Hussam Amrouch
Universität Stuttgart
H-index: 28
Europe-Germany
Top articles of Hussam Amrouch
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Cryogenic Brain-inspired Hyperdimensional In-Memory Computing using 5nm Ferroelectric FinFET | Shivendra Singh Parihar Shubham Kumar Swetaki Chatterjee Girish Pahwa Yogesh Singh Chauhan | 2024/1/3 | |
Monolithic 3D Integration using BEOL FeFET: Reliability, Thermal Effects, and DNN Accuracy | Swetaki Chatterjee Nistha Baruah Swati Deshwal Anirban Kar Shivendra Singh Parihar | 2024 | |
WaSSaBi: Wafer Selection With Self-Supervised Representations and Brain-Inspired Active Learning | IEEE Transactions on Circuits and Systems I: Regular Papers | Karthik Pandaram Paul R Genssler Hussam Amrouch | 2024/2/1 |
Machine Learning Unleashes Aging and Self-Heating Effects: From Transistors to Full Processor | Hussam Amrouch Victor van Santan Javier Diaz Fortuny Florian Klemme | 2024 | |
First Demonstration of Reconfigurable Threshold Logic Gate using FeFET | Authorea Preprints | Shubham Kumar Gian Singh Sarma Vrudhula Yogesh Singh Chauhan Hussam Amrouch | 2024/1/26 |
HDCircuit: Brain-inspired Hyperdimensional Computing for Circuit Recognition | Paul Genssler Lilas Alrahis Ozgur Sinanoglu Hussam Amrouch | 2024 | |
Unveiling Enhanced Trade-offs in SRAM-based Memory Arrays for Cryogenic CMOS Technology | Authorea Preprints | Shivendra Singh Parihar Girish Pahwa Baker Mohammad Yogesh Singh Chauhan Hussam Amrouch | 2024/1/26 |
Algorithm to Technology Co-Optimization for CiM-based Hyperdimensional Computing | Mahta Mayahinia Simon Thomann Paul R Genssler Christopher Münch Hussam Amrouch | 2024 | |
Integrated CPU Monitoring Using 2D Temperature Sensor Arrays Directly Printed on Heat Sinks | Advanced Materials Technologies | Robert Huber Daniel Belles Tim Bücher Leonard Franke Hussam Amrouch | 2024/4 |
On the Severity of Self-Heating in FDSOI at Cryogenic Temperatures: In-depth analysis from Transistors to Full Processor | Anirban Kar Florian Klemme Hussam Amrouch | 2024 | |
In-Memory Acceleration of Hyperdimensional Genome Matching on Unreliable Emerging Technologies | IEEE Transactions on Circuits and Systems I: Regular Papers | Hamza E Barkam Sanggeon Yun Paul R Genssler Che-Kai Liu Zhuowen Zou | 2024/1/26 |
Impact of Self-Heating in 5 nm FinFETs at Cryogenic Temperatures for Reliable Quantum Computing: Device-Circuit Interaction | Shivendra Parihar Girish Pawha Hussam Amrouch | 2024 | |
SyncTREE: Fast Timing Analysis for Integrated Circuit Design through a Physics-informed Tree-based Graph Neural Network | Advances in Neural Information Processing Systems | Yuting Hu Jiajie Li Florian Klemme Gi-Joon Nam Tengfei Ma | 2024/2/13 |
Cryogenic cmos for quantum processing: 5-nm finfet-based sram arrays at 10 k | IEEE Transactions on Circuits and Systems I: Regular Papers | Shivendra Singh Parihar Victor M van Santen Simon Thomann Girish Pahwa Yogesh Singh Chauhan | 2023/6/1 |
FeFET Reliability Modeling for In-Memory Computing: Challenges, Perspective, and Emerging Trends | Simon Thomann Hussam Amrouch | 2023/10/3 | |
Unlocking Efficiency in BNNs: Global by Local Thresholding for Analog-based HW Accelerators | IEEE Journal on Emerging and Selected Topics in Circuits and Systems | Mikail Yayla Fabio Frustaci Fanny Spagnolo Jian-Jia Chen Hussam Amrouch | 2023/9/14 |
Compact and high-performance TCAM based on scaled double-gate FeFETs | Liu Liu Shubham Kumar Simon Thomann Hussam Amrouch Xiaobo Sharon Hu | 2023/7/9 | |
Impact of Non-Volatile Memory Cells on Spiking Neural Network Annealing Machine With In-Situ Synapse Processing | IEEE Transactions on Circuits and Systems I: Regular Papers | Ming-Liang Wei Mikail Yayla Shu-Yin Ho Jian-Jia Chen Hussam Amrouch | 2023/8/23 |
Frontiers in AI Acceleration: From Approximate Computing to FeFET Monolithic 3D Integration | Shubham Kumar Paul R Genssler Somaya Mansour Yogesh Singh Chauhan Hussam Amrouch | 2023/10/16 | |
Technology/Algorithm Co-Design for Robust Brain-Inspired Hyperdimensional In-memory Computing | Paul R Genssler Hussam Amrouch | 2023/10/29 |
Co-Authors
