Shengchang Lu

About Shengchang Lu

Shengchang Lu, With an exceptional h-index of 8 and a recent h-index of 8 (since 2020), a distinguished researcher at Virginia Polytechnic Institute and State University, specializes in the field of High density magnetic design, high density packaging of WBG devices.

His recent articles reflect a diverse array of research interests and contributions to the field:

Double-Sided Cooling Half-Bridge Power Module of 650 V/150 A Gallium Nitride High-Electron-Mobility Transistor

Double-Side Cooled SiC MOSFET Power Modules with Sintered-Silver Interposers for a 100 kW/L Traction Inverter

Packaging of 15-kV Silicon Carbide Half-Bridge Module Enabled by a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating

Packaging of a 15-kV silicon carbide MOSFET with insulation enhanced by a nonlinear resistive polymer-nanoparticle coating

Packaging of a 10-kV double-side cooled Silicon Carbide diode module with thin substrates coated by a nonlinear resistive polymer-nanoparticle composite

Improved measurement accuracy for junction-to-case thermal resistance of GaN HEMT packages by gate-to-gate electrical resistance and stacking thermal interface materials

Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors

Additive manufacturing of hetero-magnetic coupled inductors

Shengchang Lu Information

University

Position

___

Citations(all)

231

Citations(since 2020)

227

Cited By

46

hIndex(all)

8

hIndex(since 2020)

8

i10Index(all)

6

i10Index(since 2020)

6

Email

University Profile Page

Google Scholar

Shengchang Lu Skills & Research Interests

High density magnetic design

high density packaging of WBG devices

Top articles of Shengchang Lu

Double-Sided Cooling Half-Bridge Power Module of 650 V/150 A Gallium Nitride High-Electron-Mobility Transistor

IEEE Transactions on Industrial Electronics

2024/4/29

Double-Side Cooled SiC MOSFET Power Modules with Sintered-Silver Interposers for a 100 kW/L Traction Inverter

IEEE Transactions on Power Electronics

2023/5/8

Packaging of 15-kV Silicon Carbide Half-Bridge Module Enabled by a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating

2023/12/4

Zichen Zhang
Zichen Zhang

H-Index: 1

Shengchang Lu
Shengchang Lu

H-Index: 3

Packaging of a 15-kV silicon carbide MOSFET with insulation enhanced by a nonlinear resistive polymer-nanoparticle coating

2022/10/9

Zichen Zhang
Zichen Zhang

H-Index: 1

Shengchang Lu
Shengchang Lu

H-Index: 3

Packaging of a 10-kV double-side cooled Silicon Carbide diode module with thin substrates coated by a nonlinear resistive polymer-nanoparticle composite

IEEE Transactions on Power Electronics

2022/7/12

Improved measurement accuracy for junction-to-case thermal resistance of GaN HEMT packages by gate-to-gate electrical resistance and stacking thermal interface materials

IEEE Transactions on Power Electronics

2022/1/13

Shengchang Lu
Shengchang Lu

H-Index: 3

Zichen Zhang
Zichen Zhang

H-Index: 1

Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors

IEEE Transactions on Industrial Electronics

2022/2/10

Additive manufacturing of hetero-magnetic coupled inductors

IEEE Transactions on Components, Packaging and Manufacturing Technology

2021/5/24

Packaging of (650 V, 150 A) GaN HEMT with low parasitics and high thermal performance

2021/5/12

Packaging and high-temperature characterization of a 650 V, 150 A eGaN HEMT

Semiconductor Science and Technology

2021/2/11

Shengchang Lu
Shengchang Lu

H-Index: 3

Rolando Burgos
Rolando Burgos

H-Index: 49

Packaged Ga2O3 Schottky Rectifiers With Over 60-A Surge Current Capability

IEEE Transactions on Power Electronics

2021/1/8

Heteromagnetic Swinging Inductor and Its Application for Power Factor Correction Converters

IEEE Transactions on Industry Applications

2020/10

PCB-interposer-on-DBC packaging of 650 V, 120 A GaN HEMTs

2020/3/15

See List of Professors in Shengchang Lu University(Virginia Polytechnic Institute and State University)

Co-Authors

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