Zichen Zhang

About Zichen Zhang

Zichen Zhang, With an exceptional h-index of 6 and a recent h-index of 6 (since 2020), a distinguished researcher at Virginia Polytechnic Institute and State University, specializes in the field of Power electronics packaging and integration, Materials for power electronics packaging, Insulation.

His recent articles reflect a diverse array of research interests and contributions to the field:

Effective Field Grading at 200° C of a Nonlinear Resistive Polymer Nanocomposite Coating for Medium-Voltage Power Modules

Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating

Packaging of 15-kV Silicon Carbide Half-Bridge Module Enabled by a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating

Thermo-Mechanical Analysis of a 650 V/150 A e-GaN HEMT Sandwiched Between a PCB and DBC Substrate

Effects of Encapsulant Properties on the Thermo-Mechanical Reliability of Double-Side Cooled Power Modules for Traction Inverters

Packaging of 20 kV Double-Side Cooled Silicon Carbide Diode Module With Electrical Insulation Enhanced by a Polymer-Nanoparticle Coating

Double-Side Cooled SiC MOSFET Power Modules with Sintered-Silver Interposers for a 100 kW/L Traction Inverter

Package Design of a Double-Side Cooled 20-kV Gallium Nitride Diode Module With Improved Insulation by Nonlinear Resistive Polymer-Nanoparticle Coating

Zichen Zhang Information

University

Position

___

Citations(all)

172

Citations(since 2020)

172

Cited By

1

hIndex(all)

6

hIndex(since 2020)

6

i10Index(all)

6

i10Index(since 2020)

6

Email

University Profile Page

Google Scholar

Zichen Zhang Skills & Research Interests

Power electronics packaging and integration

Materials for power electronics packaging

Insulation

Top articles of Zichen Zhang

Effective Field Grading at 200° C of a Nonlinear Resistive Polymer Nanocomposite Coating for Medium-Voltage Power Modules

IEEE Transactions on Power Electronics

2024/4

Zichen Zhang
Zichen Zhang

H-Index: 1

Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating

IEEE Transactions on Components, Packaging and Manufacturing Technology

2024/3/22

Zichen Zhang
Zichen Zhang

H-Index: 1

Emmanuel Arriola
Emmanuel Arriola

H-Index: 3

Packaging of 15-kV Silicon Carbide Half-Bridge Module Enabled by a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating

2023/12/4

Zichen Zhang
Zichen Zhang

H-Index: 1

Shengchang Lu
Shengchang Lu

H-Index: 3

Thermo-Mechanical Analysis of a 650 V/150 A e-GaN HEMT Sandwiched Between a PCB and DBC Substrate

2023/12/4

Emmanuel Arriola
Emmanuel Arriola

H-Index: 3

Zichen Zhang
Zichen Zhang

H-Index: 1

Effects of Encapsulant Properties on the Thermo-Mechanical Reliability of Double-Side Cooled Power Modules for Traction Inverters

2023/10/29

Zichen Zhang
Zichen Zhang

H-Index: 1

Packaging of 20 kV Double-Side Cooled Silicon Carbide Diode Module With Electrical Insulation Enhanced by a Polymer-Nanoparticle Coating

2023/9/4

Zichen Zhang
Zichen Zhang

H-Index: 1

Double-Side Cooled SiC MOSFET Power Modules with Sintered-Silver Interposers for a 100 kW/L Traction Inverter

IEEE Transactions on Power Electronics

2023/5/8

Package Design of a Double-Side Cooled 20-kV Gallium Nitride Diode Module With Improved Insulation by Nonlinear Resistive Polymer-Nanoparticle Coating

2023/3/19

Zichen Zhang
Zichen Zhang

H-Index: 1

Chip size minimization for wide and ultrawide bandgap power devices

IEEE Transactions on Electron Devices

2023/1/2

Packaging of a 15-kV silicon carbide MOSFET with insulation enhanced by a nonlinear resistive polymer-nanoparticle coating

2022/10/9

Zichen Zhang
Zichen Zhang

H-Index: 1

Shengchang Lu
Shengchang Lu

H-Index: 3

Packaging of a 10-kV double-side cooled Silicon Carbide diode module with thin substrates coated by a nonlinear resistive polymer-nanoparticle composite

IEEE Transactions on Power Electronics

2022/7/12

Field-Grading Effect of a Nonlinear Resistive Polymer-Nanoparticle Composite Triple-Point Coating on Direct-Bond Copper Substrates for Packaging Medium-Voltage Power Devices

2022/6/19

Zichen Zhang
Zichen Zhang

H-Index: 1

Evaluation of a nonlinear resistive polymer-nanoparticle composite for field-grading in a double-side cooled 10-kV silicon carbide rectifier module

2022/3/15

Zichen Zhang
Zichen Zhang

H-Index: 1

Low parasitic-inductance packaging of a 650 V/150 a half-bridge module using enhancement-mode Gallium-Nitride high electron mobility transistors

IEEE Transactions on Industrial Electronics

2022/2/10

Improved measurement accuracy for junction-to-case thermal resistance of GaN HEMT packages by gate-to-gate electrical resistance and stacking thermal interface materials

IEEE Transactions on Power Electronics

2022/1/13

Shengchang Lu
Shengchang Lu

H-Index: 3

Zichen Zhang
Zichen Zhang

H-Index: 1

Packaged Ga2O3 Schottky Rectifiers With Over 60-A Surge Current Capability

IEEE Transactions on Power Electronics

2021/1/8

Desired properties of a nonlinear resistive coating for shielding triple point in a medium-voltage power module

IEEE Transactions on Dielectrics and Electrical Insulation

2021/10

Zichen Zhang
Zichen Zhang

H-Index: 1

Characterization of a nonlinear resistive polymer-nanoparticle composite coating for electric field reduction in a medium-voltage power module

IEEE Transactions on Power Electronics

2021/9/13

Zichen Zhang
Zichen Zhang

H-Index: 1

Packaging of an 8-kV silicon carbide diode module with double-side cooling and sintered-silver joints

2021/8/3

Zichen Zhang
Zichen Zhang

H-Index: 1

Jiaxiang Zhang
Jiaxiang Zhang

H-Index: 21

See List of Professors in Zichen Zhang University(Virginia Polytechnic Institute and State University)

Co-Authors

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