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GQ Lu or Guo-Quan Lu or G-Q Lu

About GQ Lu or Guo-Quan Lu or G-Q Lu

GQ Lu or Guo-Quan Lu or G-Q Lu, With an exceptional h-index of 51 and a recent h-index of 30 (since 2020), a distinguished researcher at Virginia Polytechnic Institute and State University, specializes in the field of Power Electronics Packaging and Integration, Device Interconnect & Insulation, Magnetic Materials & Additive Manufacturing, Nano.

His recent articles reflect a diverse array of research interests and contributions to the field:

Double-Sided Cooling Half-Bridge Power Module of 650 V/150 A Gallium Nitride High-Electron-Mobility Transistor

Effective Field Grading at 200° C of a Nonlinear Resistive Polymer Nanocomposite Coating for Medium-Voltage Power Modules

Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating

Pressure-assisted silver sintering structure optimization for power modules

Effective Field Grading at 200o C for MediumVoltage Power Modules of a Nonlinear Resistive Polymer Nanocomposite Coating

Local Interconnection Degradation of a Double-Sided Cooling SiC MOSFET Module under Power Cycling

Packaging of 15-kV Silicon Carbide Half-Bridge Module Enabled by a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating

Thermo-Mechanical Analysis of a 650 V/150 A e-GaN HEMT Sandwiched Between a PCB and DBC Substrate

GQ Lu or Guo-Quan Lu or G-Q Lu Information

University

Position

and MSE

Citations(all)

10375

Citations(since 2020)

4053

Cited By

7854

hIndex(all)

51

hIndex(since 2020)

30

i10Index(all)

217

i10Index(since 2020)

137

Email

University Profile Page

Google Scholar

GQ Lu or Guo-Quan Lu or G-Q Lu Skills & Research Interests

Power Electronics Packaging and Integration

Device Interconnect & Insulation

Magnetic Materials & Additive Manufacturing

Nano

Top articles of GQ Lu or Guo-Quan Lu or G-Q Lu

Double-Sided Cooling Half-Bridge Power Module of 650 V/150 A Gallium Nitride High-Electron-Mobility Transistor

IEEE Transactions on Industrial Electronics

2024/4/29

Shengchang Lu
Shengchang Lu

H-Index: 3

Bo Li
Bo Li

H-Index: 27

Emmanuel Arriola
Emmanuel Arriola

H-Index: 3

Zichen Zhang
Zichen Zhang

H-Index: 1

Effective Field Grading at 200° C of a Nonlinear Resistive Polymer Nanocomposite Coating for Medium-Voltage Power Modules

IEEE Transactions on Power Electronics

2024/4

Zichen Zhang
Zichen Zhang

H-Index: 1

Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating

IEEE Transactions on Components, Packaging and Manufacturing Technology

2024/3/22

Zichen Zhang
Zichen Zhang

H-Index: 1

Emmanuel Arriola
Emmanuel Arriola

H-Index: 3

Pressure-assisted silver sintering structure optimization for power modules

2024/2/1

Hao Zhang
Hao Zhang

H-Index: 7

Zheng Liu
Zheng Liu

H-Index: 8

Effective Field Grading at 200o C for MediumVoltage Power Modules of a Nonlinear Resistive Polymer Nanocomposite Coating

IEEE Transactions on Power Electronics

2024/1/9

Zichen Zhang
Zichen Zhang

H-Index: 1

Local Interconnection Degradation of a Double-Sided Cooling SiC MOSFET Module under Power Cycling

IEEE Transactions on Components, Packaging and Manufacturing Technology

2023/12/25

Yue Chen
Yue Chen

H-Index: 8

Packaging of 15-kV Silicon Carbide Half-Bridge Module Enabled by a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating

2023/12/4

Zichen Zhang
Zichen Zhang

H-Index: 1

Shengchang Lu
Shengchang Lu

H-Index: 3

Thermo-Mechanical Analysis of a 650 V/150 A e-GaN HEMT Sandwiched Between a PCB and DBC Substrate

2023/12/4

Emmanuel Arriola
Emmanuel Arriola

H-Index: 3

Zichen Zhang
Zichen Zhang

H-Index: 1

Effects of Encapsulant Properties on the Thermo-Mechanical Reliability of Double-Side Cooled Power Modules for Traction Inverters

2023/10/29

Zichen Zhang
Zichen Zhang

H-Index: 1

Effects of Pores on Crack Propagation in Sintered-Silver Die Attach: A Baseline Model

2023/10/24

Emmanuel Arriola
Emmanuel Arriola

H-Index: 3

Aristotle Ubando
Aristotle Ubando

H-Index: 16

Packaging of 20 kV Double-Side Cooled Silicon Carbide Diode Module With Electrical Insulation Enhanced by a Polymer-Nanoparticle Coating

2023/9/4

Zichen Zhang
Zichen Zhang

H-Index: 1

On-Site Estimation of Thermal Resistance Degradation of Double-Sided Cooling (DSC) Power Modules under Power Cycling Conditions

IEEE Journal of Emerging and Selected Topics in Power Electronics

2023/5/22

Yue Chen
Yue Chen

H-Index: 8

Double-Side Cooled SiC MOSFET Power Modules with Sintered-Silver Interposers for a 100 kW/L Traction Inverter

IEEE Transactions on Power Electronics

2023/5/8

Chao Ding
Chao Ding

H-Index: 5

Shengchang Lu
Shengchang Lu

H-Index: 3

Zichen Zhang
Zichen Zhang

H-Index: 1

Kun Zhang
Kun Zhang

H-Index: 13

Tam Nguyen
Tam Nguyen

H-Index: 0

Rolando Burgos
Rolando Burgos

H-Index: 49

Review of Double Sided Cooling Power Modules for Driving Electric Vehicles

IEEE Transactions on Device and Materials Reliability

2023/5/4

Feasibility Investigation and Characterization of Liquid Dispersant–Assisted Sintering of Silver to Bond Large‐Area Plates

Advanced Engineering Materials

2023/5

Xin Li
Xin Li

H-Index: 15

Package Design of a Double-Side Cooled 20-kV Gallium Nitride Diode Module With Improved Insulation by Nonlinear Resistive Polymer-Nanoparticle Coating

2023/3/19

Zichen Zhang
Zichen Zhang

H-Index: 1

Copper-Wire Stress Buffers for Extending Lifetime of Double-Sided Bidirectional SiC Modules

IEEE Transactions on Power Electronics

2023/3/3

Siqi Liu
Siqi Liu

H-Index: 3

Jing Li
Jing Li

H-Index: 19

Xin Li
Xin Li

H-Index: 15

Chip size minimization for wide and ultrawide bandgap power devices

IEEE Transactions on Electron Devices

2023/1/2

Ming Xiao
Ming Xiao

H-Index: 4

Zichen Zhang
Zichen Zhang

H-Index: 1

Yifan Wang
Yifan Wang

H-Index: 10

Yuan Qin
Yuan Qin

H-Index: 8

Qihao Song
Qihao Song

H-Index: 2

Khai Ngo
Khai Ngo

H-Index: 28

Yuhao Zhang
Yuhao Zhang

H-Index: 16

High thermal conductivity diamond-doped silver paste for power electronics packaging

Materials Letters

2022/3/15

Xin Li
Xin Li

H-Index: 15

Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 C

IEEE Transactions on Components, Packaging and Manufacturing Technology

2022/3/11

Shi Chen
Shi Chen

H-Index: 4

Xin Li
Xin Li

H-Index: 15

See List of Professors in GQ Lu or Guo-Quan Lu or G-Q Lu University(Virginia Polytechnic Institute and State University)

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