SAPTADEEP PAL
University of California, Los Angeles
H-index: 11
North America-United States
Top articles of SAPTADEEP PAL
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
DeepFlow: A cross-stack pathfinding framework for distributed ai systems | ACM Transactions on Design Automation of Electronic Systems | Newsha Ardalani Saptadeep Pal Puneet Gupta | 2024/2/15 |
Chiplets: How Small is too Small? | Alexander Graening Saptadeep Pal Puneet Gupta | 2023/7/9 | |
TSV-less Power Delivery for Wafer-scale Assemblies and Interposers | Haoxiang Ren Saptadeep Pal Guangqi Ouyang Randall Irwin Yu-Tao Yang | 2022/5/31 | |
Scale-Out Packageless Processing | Saptadeep Pal | 2021 | |
Designing a 2048-chiplet, 14336-core waferscale processor | Saptadeep Pal Jingyang Liu Irina Alam Nicholas Cebry Haris Suhail | 2021/12/5 | |
I/o architecture, substrate design, and bonding process for a heterogeneous dielet-assembly based waferscale processor | Saptadeep Pal Irina Alam Krutikesh Sahoo Haris Suhail Rakesh Kumar | 2021/6/1 | |
Flexible connectors and PCB segmentation for signaling and power delivery in wafer-scale systems | Randall Irwin Krutikesh Sahoo Saptadeep Pal Subramanian S Iyer | 2021/6/1 | |
Copper to gold thermal compression bonding in heterogenous wafer-scale systems | Krutikesh Sahoo Saptadeep Pal Niloofar Shakoorzadeh Yu-Tao Yang Subramanian S Iyer | 2021/6/1 | |
Parallelization strategies for training a neural network | 2020/11/26 | ||
Pathfinding for 2.5 D interconnect technologies | Saptadeep Pal Puneet Gupta | 2020/11/5 | |
Design space exploration for chiplet-assembly-based processors | IEEE Transactions on Very Large Scale Integration (VLSI) Systems | Saptadeep Pal Daniel Petrisko Rakesh Kumar Puneet Gupta | 2020/2/13 |
Co-Authors
