SUBRAMANIAN S. IYER
University of California, Los Angeles
H-index: 62
North America-United States
Top articles of SUBRAMANIAN S. IYER
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Nonvolative memory devices with charge trap transistor structures and methods of operation thereof | 2024/3/14 | ||
Integrated Micro-Capacitors & Micro-Inductors for Next Generation Electronics | IEEE Nanotechnology Magazine | G Ezhilarasu SS Iyer | 2024/2/21 |
Neural network system with neurons including charge-trap transistors and neural integrators and methods therefor | 2024/1/25 | ||
Demonstration of a Power-efficient and Cost-effective Power Delivery Architecture for Heterogeneously Integrated Wafer-scale Systems | Haoxiang Ren Krutikesh Sahoo Tianyu Xiang Guangqi Ouyang Subramanian S Iyer | 2023/5/30 | |
An 8T eNVSRAM Macro in 22nm FDSOI Standard Logic with Simultaneous Full-Array Data Restore for Secure IoT Devices | Sepideh Nouri Subramanian S Iyer | 2023/2/19 | |
AI computing reaches for the edge | Science | Subramanian S Iyer Vwani Roychowdhury | 2023/10/20 |
Apparatus and method for changing the functionality of an integrated circuit using charge trap transistors | 2023/6/8 | ||
3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices | Guangqi Ouyang Takafumi Fukushima Haoxiang Ren Subramanian S Iyer | 2023/5/30 | |
Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold Thermocompression Bonding | Ankit Kuchhangi Haoxiang Ren Krutikesh Sahoo Subramanian S Iyer | 2023/5/30 | |
Flexible inorganic microled display device and method of manufacturing thereof | 2023/7/27 | ||
Low-frequency and random telegraph noise in 14-nm bulk si charge-trap transistors | IEEE Transactions on Electron Devices | Mariia Gorchichko En Xia Zhang Mahmud Reaz Kan Li Peng Fei Wang | 2023/4/25 |
System and method for superconducting silicon interconnect substrate with superconducting quantum processor | 2023/7/13 | ||
Secure and Scalable Key Management for Waferscale Heterogeneous Integration | Yousef Safari Pooya Aghanoury Subramanian S Iyer Nader Sehatbakhsh | 2023/5/30 | |
Advanced Packaging and Heterogenous Integration | Subramanian Iyer | 2023/4/17 | |
A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration | Krutikesh Sahoo Haoxiang Ren Subramanian S Iyer | 2023/5/30 | |
Hybrid obfuscation of chiplet-based systems | Yousef Safari Pooya Aghanoury Subramanian S Iyer Nader Sehatbakhsh Boris Vaisband | 2023/7/9 | |
Scaling Heterogenous Integration from Dies to Materials | Subramanian Iyer | 2023/4/17 | |
Advanced Packaging Methods Used for Energy Storage from Intermittent Renewable Sources | Takafumi Fukushima Tianyu Xiang Harshit Ranjan Niharika Tripathi Chang Liu | 2023/5/30 | |
Heterogeneous Power Delivery for Large Chiplet-based Systems using Integrated GaN/Si-Interconnect Fabric with sub-10 μm Bond Pitch | Haoxiang Ren Krutikesh Sahoo Ziyi Guo Rishi Pugazhendhi Zachary Wong | 2023/12/9 | |
Silicon‐Germanium Heterojunction Bipolar Transistors: A Retrospective | 75th Anniversary of the Transistor | Subramanian S Iyer John D Cressler | 2023/7/3 |
Co-Authors
