Takafumi Fukushima
Tohoku University
H-index: 32
Asia-Japan
Top articles of Takafumi Fukushima
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Display device | 2018/1/2 | ||
Direct fabrication of SU‐8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor | Electronics and Communications in Japan | Hiromichi Wakebe Takafumi Fukushima Tetsu Tanaka | 2022/6 |
Flexible and stretchable interconnects for flexible systems | 2022/12/27 | ||
Evaluation of vascular anatomy for colon cancer located in the splenic flexure using the preoperative three-dimensional computed tomography angiography with colonography | International Journal of Colorectal Disease | K Iguchi H Mushiake S Hasegawa T Fukushima M Numata | 2021/2 |
Wafer-Level Flexible 3D Corrugated Interconnect Formation for Scalable In-Mold Electronics with Embedded Chiplets | Tomo Odashima Yuki Susumago Shuta Nagata Hisashi Kino Tetsu Tanaka | 2021/6/1 | |
Chip-to-Chip/Wafer Three-Dimensional Integration of 2.5 mm-sized Neuron and Memory Chips by Via-Last Approach | M Murugesan H Hashimoto Jichel Bea M Koyanagi T Fukushima | 2021/10/5 | |
A TSV-Last Approach for 3D-IC Integration and Packaging using WNi Platable Barrier Layer | Murugesan Mariappan Kiyoharu Mori Mitsumasa Koyanagi Takafumi Fukushima | 2021/6/1 | |
High-thermal-stability resistor formed from manganese nitride compound that exhibits the saturation state of the mean free path | Applied Physics Express | Hisashi Kino Takafumi Fukushima Tetsu Tanaka | 2021/8/10 |
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing | Takafumi Fukushima Shinichi Sakuyama Masatomo Takahashi Hiroyuki Hashimoto Jichoel Bea | 2021/10/26 | |
FOWLP-based flexible hybrid electronics with 3D-IC chiplets for smart skin display | Yuki Susumago Tomo Odashima Masatsugu Ichikawa Hiroki Hanaoka Hisashi Kino | 2021/6/1 | |
Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics | Zhe Wang Ikumi Ozawa Yuki Susumago Tomo Odashima Noriyuki Takahashi | 2021/7/6 | |
Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing | Koji Kiyoyama Yoshihiko Horio Takafumi Fukushima Hiroyuki Hashimoto Takemori Orima | 2021/10/26 | |
Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics | Japanese Journal of Applied Physics | M Murugesan Y Susumago K Sumitani Y Imai S Kimura | 2021/2/25 |
Development of Manganese Nitride Resistor with Near-Zero Temperature-Coefficient of Resistance to Achieve High-Thermal-Stability ICs | Hisashi Kino Takafumi Fukushima Tetsu Tanaka | 2021/7/6 | |
Cu-Cu direct bonding through highly oriented Cu grains for 3D-LSI applications | Mariappan Murugesan E Sone A Simomura Makoto Motoyoshi M Sawa | 2021/10/26 | |
Flexible fan-out wafer level process and structure | 2021/2/23 | ||
Chiplet-based advanced packaging technology from 3D/TSV to FOWLP/FHE | Takafumi Fukushima | 2021/6/13 | |
Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System | Yaogan Liana Zhengyang Qian Bang Du Jinming Ye Kohei Nakamura | 2021/10/7 | |
シリコン材料・デバイス | 電子情報通信学会技術研究報告 | Murugesan Mariappan Takafumi Fukushima | 2020/2/7 |
Development of non-volatile tunnel-FET memory as a synaptic device for low-power spiking neural networks | Hisashi Kino Takafumi Fukushima Tetsu Tanaka | 2020/4/6 |
