Harindra Kumar Kannojia

About Harindra Kumar Kannojia

Harindra Kumar Kannojia, With an exceptional h-index of 7 and a recent h-index of 7 (since 2020), a distinguished researcher at Indian Institute of Technology Bombay, specializes in the field of LIFT, heterogenous integration, Cu-Sn SLID, advanced Packaging, MEMS.

His recent articles reflect a diverse array of research interests and contributions to the field:

Microlens integration on photonic integrated circuits: a platform for achieving relaxed packaging tolerances and hybrid integration of external functionality

Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform

Assembly of thin micro-chiplets using laser-induced forward transfer

Towards a Full-Color MicroLED Display with a Patterned Quantum Dot Color Conversion Layer

Laser-Induced Forward Transfer for Assembly of Silicon Micro-Chiplets

Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate

A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging

Challenges in fabrication of high aspect ratio electrostatic comb-drive microactuator using one-step X-ray lithography

Harindra Kumar Kannojia Information

University

Position

___

Citations(all)

252

Citations(since 2020)

251

Cited By

82

hIndex(all)

7

hIndex(since 2020)

7

i10Index(all)

5

i10Index(since 2020)

5

Email

University Profile Page

Google Scholar

Harindra Kumar Kannojia Skills & Research Interests

LIFT

heterogenous integration

Cu-Sn SLID

advanced Packaging

MEMS

Top articles of Harindra Kumar Kannojia

Title

Journal

Author(s)

Publication Date

Microlens integration on photonic integrated circuits: a platform for achieving relaxed packaging tolerances and hybrid integration of external functionality

Jeroen Missinne

Rik Verplancke

Yao-Tung Chang

Jef Van Asch

Harindra Kannojia

...

2024/3/12

Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform

Dongbo Wang

Harindra Kumar Kannojia

Pierre Jouy

Etienne Giraud

Geert Van Steenberge

...

2023/4/4

Assembly of thin micro-chiplets using laser-induced forward transfer

Harindra Kumar Kannojia

Geert Van Steenberge

2023

Towards a Full-Color MicroLED Display with a Patterned Quantum Dot Color Conversion Layer

Dieter Cuypers

Harindra Kannojia

Geert Van Steenberge

2023

Laser-Induced Forward Transfer for Assembly of Silicon Micro-Chiplets

Harindra Kumar Kannojia

Geert Van Steenberge

2022/12/7

Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate

Microsystem Technologies

Harindra Kumar Kannojia

Aboobackkar Sidhique

Ambika Shanker Shukla

Jaising Pednekar

Shalabh Gupta

...

2022/4/1

A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging

Harindra Kumar Kannojia

Pradeep Dixit

2021/3

Challenges in fabrication of high aspect ratio electrostatic comb-drive microactuator using one-step X-ray lithography

ISSS Journal of Micro and Smart Systems

Rahul Shukla

Harindra Kumar Kannojia

C Mukherjee

P Ram Sankar

BS Thakur

...

2020/11

Fabrication and Characterization of Through-glass vias (TGV) based 3D Spiral and Toroidal Inductors by Cost-effective ECDM Process

Harindra K Kannojia

Julfekar Arab

Aboobackkar Sidhique

Dileep K Mishra

Ritesh Kumar

...

2020/6/3

Through-substrate vias based three-dimensional interconnection technology

Pradeep Dixit

Harindra Kumar Kannojia

Kimmo Henttinen

2020/1/1

See List of Professors in Harindra Kumar Kannojia University(Indian Institute of Technology Bombay)

Co-Authors

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