Pradeep Dixit
Indian Institute of Technology Bombay
H-index: 25
Asia-India
Top articles of Pradeep Dixit
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Micromachining of alumina ceramic for microsystems applications: a systematic review, challenges and future opportunities | Materials and Manufacturing Processes | Anurag Shanu Priyaranjan Sharma Pradeep Dixit | 2024/4/1 |
Facilitating electroless metalization of blind holes in glass substrates by electrochemical discharge-assisted surface roughening | Materials Letters | Karan Pawar Pradeep Dixit | 2023/12/30 |
Enhancing the borosilicate glass micromachining by using mixed alkaline electrolytes in the ECDM process | Materials and Manufacturing Processes | Akshay Doke Avinash M Badadhe Pradeep Dixit | 2024/2/7 |
Electrochemical micromachining: Fundamentals and advancements | Ramver Singh Pradeep Dixit | 2023/1/1 | |
Etching of micro-channels in fused quartz for novel device applications | Materials Today: Proceedings | Shubhava Shetty Dileep Kumar Mishra Pradeep Dixit Shrushti S Shetty A Jayarama | 2023/8/8 |
Gas bubbles entrapment mechanism in the electrochemical discharge machining involving multi-tip array electrodes | Journal of Manufacturing Processes | Julfekar Arab Pradeep Dixit | 2023/8/4 |
Fabrication of 3D microstructures in glass by direct writing electrochemical discharge machining | Materials and Manufacturing Processes | Dileep Kumar Mishra Pradeep Dixit | 2023/6/11 |
Surface finishing of an additively manufactured part using electrochemical jet machining | Materials Today Communications | Pravin Kumar Pradeep Dixit Bhavesh Chaudhary Neelesh Kumar Jain | 2023/6 |
Through Glass Vias Fabrication using Ultrasonic Micromachining and Electroless Deposition | Karan Pawar Harsh Pandey Pradeep Dixit | 2023/12/5 | |
Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging | Materials and Manufacturing Processes | Karan Pawar Pradeep Dixit | 2022/7/28 |
Investigation on tribo-characteristics of electrochemical jet machined part manufactured by laser powder bed fusion | Tribology International | Pravin Kumar Bhavesh Chaudhary NK Jain Mahesh Patel Pradeep Dixit | 2023/7/5 |
A review on microholes formation in glass-based substrates by electrochemical discharge drilling for MEMS applications | Tarlochan Singh Julfekar Arab Pradeep Dixit | 2022/3/4 | |
Formation of macro-sized through-holes in glass using notch-shaped tubular electrodes in electrochemical discharge machining | Journal of Manufacturing Processes | Julfekar Arab Pradeep Dixit | 2022/6/1 |
Investigation of tool wear in alumina micromachining by multi-tip ECDM | Materials and Manufacturing Processes | Priyaranjan Sharma Pradeep Dixit | 2022/2/17 |
Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging | Materials Letters | Vishnu Kant Bajpai Harsh Pandey Tarlochan Singh Pradeep Dixit | 2022/6/1 |
Theoretical and numerical investigation of a new 3-axis SU-8 MEMS piezoresistive accelerometer | Microelectronics Journal | Awatef Khlifi Aftab Ahmed Brahim Mezghani Rajul Patkar Pradeep Dixit | 2022/10/1 |
Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications | Applied Surface Science | Vishnu Kant Bajpai Dileep Kumar Mishra Pradeep Dixit | 2022/5/15 |
Formation of high aspect ratio through-glass vias by the combination of Ultrasonic micromachining and copper electroplating | Journal of Manufacturing Processes | Harsh Pandey Tarlochan Singh Pradeep Dixit | 2022/10/1 |
Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process | Journal of Applied Electrochemistry | Tarlochan Singh Dileep Kumar Mishra Pradeep Dixit | 2022/4 |
Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications | Materials and Manufacturing Processes | Dileep Kumar Mishra Tarlochan Singh Pradeep Dixit | 2022/9/10 |
Co-Authors
