Dileep Kumar Mishra
Indian Institute of Technology Bombay
H-index: 13
Asia-India
Top articles of Dileep Kumar Mishra
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Improved waveguide surface roughness by foundry-processing techniques for enhanced light delivery to integrated ion trap for quantum computing platforms | Simon CK Goh Adrian N Utama Haitao Yu Yan Y Zhou Mishra Dileep Kumar | 2024/3/11 | |
Process Development and Integration on Si Substrate for Ion trap-based Quantum Processors | Chui King Li H. Y. and Liu Huihong Clarence and Jaafar Norhanani and Ahmadi Morteza and Kumar | 2023 | |
Reliability Assessment of 2.5 D Module using Chip to Wafer Hybrid Bonding | Ser Choong Chong Jason Au Keng Yuen Vasarla Nagendra Sekhar Ismael Cereno Daniel Mishra Dileep Kumar | 2023/12/5 | |
Etching of micro-channels in fused quartz for novel device applications | Materials Today: Proceedings | Shubhava Shetty Dileep Kumar Mishra Pradeep Dixit Shrushti S Shetty A Jayarama | 2023/8/8 |
Fabrication of 3D microstructures in glass by direct writing electrochemical discharge machining | Materials and Manufacturing Processes | Dileep Kumar Mishra Pradeep Dixit | 2023/6/11 |
Polymer Dielectric Materials Evaluation for Hybrid Bonding Applications | Vasarla Nagendra Sekhar Takenori Fujiwara Hitoshi Araki Yu Shoji Masaya Jukei | 2023/12/5 | |
Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding | Vasarla Nagendra Sekhar Mishra Dileep Kumar Prayudi Lianto Ser Choong Chong Vempati Srinivasa Rao | 2023/5/30 | |
Evaluation of Low Temperature Inorganic Dielectric Materials for Hybrid Bonding Applications | Mishra Dileep Kumar Vasarla Nagendra Sekhar Chong Ser Choong BSS Chandra Rao King-Jien Chui | 2023/12/5 | |
Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process | Journal of Applied Electrochemistry | Tarlochan Singh Dileep Kumar Mishra Pradeep Dixit | 2022/4 |
Thin Memory Chip Fabrication for Multi-stack Hybrid Bonding Applications | VN Sekhar Dileep Kumar Mishra Chong Ser Choong Vempati Srinivasa Rao | 2022/12/7 | |
Evaluation of Polymer Materials for Hybrid Bonding Application | Dileep Kumar Mishra VN Sekhar Chong Ser Choong Vempati Srinivasa Rao | 2022/12/7 | |
Automated Analysis of AFM Data of High-Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) and Chip-to-Wafer (C2W) Hybrid Bonding | Jiakai Chen Yong Chyn Ng Dileep K Mishra KJ Chui | 2022/12/7 | |
Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications | Materials and Manufacturing Processes | Dileep Kumar Mishra Tarlochan Singh Pradeep Dixit | 2022/9/10 |
Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications | Applied Surface Science | Vishnu Kant Bajpai Dileep Kumar Mishra Pradeep Dixit | 2022/5/15 |
Experimental investigation into tool wear behaviour of line-array tool electrode during the electrochemical discharge micromilling process | Journal of Manufacturing Processes | Dileep Kumar Mishra Pradeep Dixit | 2021/12/1 |
Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling | Measurement | Julfekar Arab Dileep Kumar Mishra Pradeep Dixit | 2021/1/15 |
Investigations into surface topography of glass microfeatures formed by pulsed electrochemical discharge milling for microsystem applications | Microsystem Technologies | Aman Kumar Verma Dileep Kumar Mishra Karan Pawar Pradeep Dixit | 2020/6 |
Effect of Tool Electrode-Workpiece Gap in the Microchannel Formation by Electrochemical Discharge Machining | ECS Journal of Solid State Science and Technology | Dileep Kumar Mishra Karan Pawar Pradeep Dixit | 2020/3/31 |
Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining | Journal of Applied Electrochemistry | Subrat Kumar Patro Dileep Kumar Mishra Julfekar Arab Pradeep Dixit | 2020/2 |
Experimental investigations into alumina ceramic micromachining by electrochemical discharge machining process | Procedia Manufacturing | Priyaranjan Sharma Dileep Kumar Mishra Pradeep Dixit | 2020/1/1 |
Co-Authors
