Sung Kyu Lim
Georgia Institute of Technology
H-index: 50
North America-United States
Top articles of Sung Kyu Lim
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
On Legalization of Die Bonding Bumps and Pads for 3D ICs | Sai Pentapati Anthony Agnesina Moritz Brunion Yen-Hsiang Huang Sung Kyu Lim | 2023/3/26 | |
FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning | Hao-Hsiang Hsiao Yi-Chen Lu Pruek Vanna-Iampikul Sung Kyu Lim | 2024/3/12 | |
GAN-Place: Advancing Open Source Placers to Commercial-quality Using Generative Adversarial Networks and Transfer Learning | ACM Transactions on Design Automation of Electronic Systems | Yi-Chen Lu Haoxing Ren Hao-Hsiang Hsiao Sung Kyu Lim | 2024/2/15 |
Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost Tradeoffs | IEEE Transactions on Very Large Scale Integration (VLSI) Systems | Sai Pentapati Sung-Kyu Lim | 2024/1/4 |
Power, Performance, Area, and Cost Analysis of Face-to-Face Bonded 3D ICs | IEEE Transactions on Components, Packaging and Manufacturing Technology | Anthony Agnesina Moritz Brunion Jinwoo Kim Alberto Garcia-Ortiz Dragomir Milojevic | 2023/4/5 |
Abisko: Deep codesign of an architecture for spiking neural networks using novel neuromorphic materials | The International Journal of High Performance Computing Applications | Jeffrey S Vetter Prasanna Date Farah Fahim Shruti R Kulkarni Petro Maksymovych | 2023/7 |
On Continuing DNN Accelerator Architecture Scaling Using Tightly Coupled Compute-on-Memory 3-D ICs | IEEE Transactions on Very Large Scale Integration (VLSI) Systems | Gauthaman Murali Aditya Iyer Lingjun Zhu Jianming Tong Francisco Muñoz Martínez | 2023/8/16 |
Hier-3D: A Methodology for Physical Hierarchy Exploration of 3D ICs | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems | Nesara Eranna Bethur Anthony Agnesina Moritz Brunion Alberto Garcia-Ortiz Francky Catthoor | 2023/12/14 |
DREAM-GAN: Advancing dreamplace towards commercial-quality using generative adversarial learning | Yi-Chen Lu Haoxing Ren Hao-Hsiang Hsiao Sung Kyu Lim | 2023/3/26 | |
A 3D Implementation of Convolutional Neural Network for Fast Inference | Narasinga Rao Miniskar Pruek Vanna-Iampikul Aaron Young Sung Kyu Lim Frank Liu | 2023/5/21 | |
A Comparative Study on Front-Side, Buried and Back-Side Power Rail Topologies in 3nm Technology Node | Sandra Maria Shaji Lingjun Zhu Junsik Yoon Sung Kyu Lim | 2023/8/7 | |
Pin-3D: Effective Physical Design Methodology for Multi-Die Co-Optimization in Monolithic 3D ICs | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems | Sai Pentapati Kyungwook Chang Sung Kyu Lim | 2023/11/29 |
Built-in self-test of high-density and realistic ILV layouts in monolithic 3-D ICs | IEEE Transactions on Very Large Scale Integration (VLSI) Systems | Arjun Chaudhuri Sanmitra Banerjee Jinwoo Kim Sung Kyu Lim Krishnendu Chakrabarty | 2023/1/17 |
Eco-gnn: Signoff power prediction using graph neural networks with subgraph approximation | ACM Transactions on Design Automation of Electronic Systems | Yi-Chen Lu Siddhartha Nath Sai Pentapati Sung Kyu Lim | 2023/5/17 |
Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps | Lingjun Zhu Sung Kyu Lim | 2023/7/9 | |
3DNN-Xplorer: A Machine Learning Framework for Design Space Exploration of Heterogeneous 3D DNN Accelerators | Gauthaman Murali Aditya Iyer Navneeth Ravichandran Sung Kyu Lim | 2023/10/28 | |
Circuit Optimization for 2D and 3D ICs with Machine Learning | Anthony Agnesina Yi-Chen Lu Sung Kyu Lim | 2023/1/1 | |
Transferable Graph Neural Network-based Delay-Fault Localization for Monolithic 3D ICs | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems | Shao-Chun Hung Sanmitra Banerjee Arjun Chaudhuri Jinwoo Kim Sung Kyu Lim | 2023/5/11 |
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits | Pruek Vanna-Iampikul Lingjun Zhu Serhat Erdogan Mohanalingam Kathaperumal Ravi Agarwal | 2023/7/9 | |
GNN-based Multi-bit Flip-flop Clustering and Post-clustering Design Optimization for Energy-efficient 3D ICs | ACM Transactions on Design Automation of Electronic Systems | Pruek Vanna-Iampikul Yi-Chen Lu Da Eun Shim Sung Kyu Lim | 2023/9/8 |
Co-Authors
