Sten Vollebregt
Technische Universiteit Delft
H-index: 19
Europe-Netherlands
Top articles of Sten Vollebregt
Highly-sensitive wafer-scale transfer-free graphene MEMS condenser microphones
Microsystems & Nanoengineering
2024/2/21
Hutomo Suryo Wasisto
H-Index: 21
Sten Vollebregt
H-Index: 11
Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
Applied Physics Letters
2024/2/19
Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures
2024/1/21
Jiarui Mo
H-Index: 1
Verena Maier-Kiener
H-Index: 23
Daniel Kiener
H-Index: 36
Sten Vollebregt
H-Index: 11
Guoqi Zhang
H-Index: 33
Surface modification of multilayer graphene electrodes by local printing of platinum nanoparticles using spark ablation for neural interfacing
Nanoscale
2024
Sten Vollebregt
H-Index: 11
An analog to digital converter in a SiC CMOS technology for high-temperature applications
Applied Physics Letters
2024/4/8
Jiarui Mo
H-Index: 1
Alexander May
H-Index: 22
Chiara Rossi
H-Index: 3
Guoqi Zhang
H-Index: 33
Sten Vollebregt
H-Index: 11
Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor
2024/4/7
A high aspect ratio surface micromachined accelerometer based on a SiC-CNT composite material
Microsystems & Nanoengineering
2024/3/22
A Fully Integrated Sequential Synchronized Switch Harvesting on Capacitors Rectifier Based on Split-Electrode for Piezoelectric Energy Harvesting
IEEE Transactions on Power Electronics
2024/2/26
Jiarui Mo
H-Index: 1
Zhiyuan Chen
H-Index: 22
Sten Vollebregt
H-Index: 11
Guoqi Zhang
H-Index: 33
Sijun Du
H-Index: 15
Quantifying stress distribution in ultra-large graphene drums through mode shape imaging
arXiv preprint arXiv:2311.00443
2023/11/1
Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications
2023/10/29
Jiarui Mo
H-Index: 1
Alexander May
H-Index: 22
Chiara Rossi
H-Index: 3
Guoqi Zhang
H-Index: 33
Sten Vollebregt
H-Index: 11
Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
IEEE Transactions on Electron Devices
2023/9/14
Time-Dependent Dielectric Breakdown of 4H-SiC MOSFETs in CMOS Technology
2023/8/8
Nanostructured Thermoelectric Films Synthesised by Spark Ablation and Their Oxidation Behaviour
Nanomaterials
2023/5/31
Electromigration-induced local dewetting in Cu films
2023/5/22
Microfabricated albedo insensitive sun position sensor system in silicon carbide with integrated 3D optics and CMOS electronics
Sensors and Actuators A: Physical
2023/5/1
Coupling model of electromigration and experimental verification–Part I: Effect of atomic concentration gradient
Journal of the Mechanics and Physics of Solids
2023/5/1
A Highly Linear Temperature Sensor Operating up to 600° C in a 4H-SiC CMOS Technology
IEEE Electron Device Letters
2023/4/19
The sensitivity enhancement of TiO2-based VOCs sensor decorated by gold at room temperature
Nanotechnology
2023/4/6
Mostafa Shooshtari
H-Index: 1
Sten Vollebregt
H-Index: 11
Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
Applied Thermal Engineering
2023/2/25
Optimization of multilayer graphene-based gas sensors by ultraviolet photoactivation
Applied Surface Science
2023/2/1
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