Guo Qi Zhang

About Guo Qi Zhang

Guo Qi Zhang, With an exceptional h-index of 54 and a recent h-index of 37 (since 2020), a distinguished researcher at Technische Universiteit Delft, specializes in the field of Electronic packaging, sensors, reliability, WBS.

His recent articles reflect a diverse array of research interests and contributions to the field:

Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

Effects of natural and thermal oxidation on electronic and optical properties of monolayer WS2: a theoretical study

Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification

Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor

Warpage deformation analysis of AMB ceramic substrates in power modules

Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Guo Qi Zhang Information

University

Position

Professor

Citations(all)

13723

Citations(since 2020)

7188

Cited By

7946

hIndex(all)

54

hIndex(since 2020)

37

i10Index(all)

350

i10Index(since 2020)

193

Email

University Profile Page

Google Scholar

Guo Qi Zhang Skills & Research Interests

Electronic packaging

sensors

reliability

WBS

Top articles of Guo Qi Zhang

Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

2024/4/7

Effects of natural and thermal oxidation on electronic and optical properties of monolayer WS2: a theoretical study

2024/4/7

Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification

2024/4/7

Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor

2024/4/7

Warpage deformation analysis of AMB ceramic substrates in power modules

2024/4/7

Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

2024/4/7

Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

2024/4/7

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

2024/4/7

Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study

Materials & Design

2024/4/1

Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

Materials Science and Engineering: A

2024/4/1

Optimal Design of 100–2000 V 4H–SiC Power MOSFETs using Multi-objective Particle Swarm Optimization Algorithms

IEEE Electron Device Letters

2024/3/26

A high aspect ratio surface micromachined accelerometer based on a SiC-CNT composite material

Microsystems & Nanoengineering

2024/3/22

In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks

Expert Systems with Applications

2024/3/15

Insights into the effect of susceptor rotational speed in CVD reactor on the quality of 4H-SiC epitaxial layer on homogeneous substrates

Materials Today Communications

2024/3/1

A Fully Integrated Sequential Synchronized Switch Harvesting on Capacitors Rectifier Based on Split-Electrode for Piezoelectric Energy Harvesting

IEEE Transactions on Power Electronics

2024/2/26

Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction

Applied Physics Letters

2024/2/19

Aging and Sintered Layer Defect Detection of Discrete MOSFETs Using Frequency Domain Reflectometry Associated With Parasitic Resistance

IEEE Transactions on Device and Materials Reliability

2024/2/8

From Short Circuit to Completed Circuit: Conductive Hydrogel Facilitating Oral Wound Healing

Advanced Healthcare Materials

2024/2/2

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Materials & Design

2024/2/1

Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling

Case Studies in Thermal Engineering

2024/2/1

See List of Professors in Guo Qi Zhang University(Technische Universiteit Delft)

Co-Authors

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