JW XIAN
Imperial College London
H-index: 15
Europe-United Kingdom
Top articles of JW XIAN
Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints
Journal of the Mechanics and Physics of Solids
2024/6/1
Facets Formation of Ag3Sn Intermetallic in Sn-Bi-Ag Alloys: An EBSD and First-Principles Study
JOM
2024/4/3
Jw Xian
H-Index: 11
Microstructure effects on the thermal fatigue of solder joints: coupling damage measurements with multi-scale modelling
arXiv preprint arXiv:2311.03891
2023/11/7
Jw Xian
H-Index: 11
Fpe Dunne
H-Index: 36
Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys
Acta Materialia
2023/5/1
Jw Xian
H-Index: 11
Eutectic solidification in Mg-9Al-0.7 Zn: From divorced to coupled growth
Journal of Alloys and Compounds
2023/3/25
Ag3Sn Morphology Transitions During Eutectic Growth in Sn–Ag Alloys
Metallurgical and Materials Transactions A
2023/3
Jw Xian
H-Index: 11
Multi-scale plasticity homogenization of Sn–3Ag-0.5 Cu: From β-Sn micropillars to polycrystals with intermetallics
Materials Science and Engineering: A
2022/10/10
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
International Journal of Plasticity
2022/8/1
Eutectic intermetallic formation during solidification of a Mg-Sn-Al-Zn-Mn alloy
Materials Characterization
2022/4/1
Al–Mn–Fe intermetallic formation in AZ91 magnesium alloys: Effects of impurity iron
Intermetallics
2022/3/1
Al-Mn Intermetallics in High Pressure Die Cast AZ91 and Direct Chill Cast AZ80
Metals
2022/2
Al11Mn4 formation on Al8Mn5 during the solidification and heat treatment of AZ-series magnesium alloys
Materialia
2021/9/1
Jw Xian
H-Index: 11
Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony
Journal of Electronic Materials
2021/3
Jw Xian
H-Index: 11
Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints
Journal of Electronic Materials
2021/3
Jw Xian
H-Index: 11
Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5 Cu solder
International Journal of Plasticity
2021/2
Al8Mn5 in High-Pressure Die Cast AZ91: Twinning, Morphology and Size Distributions
Metallurgical and Materials Transactions A
2020/5
Jw Xian
H-Index: 11
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