Mohd Arif Anuar Mohd Salleh
Universiti Malaysia Perlis
H-index: 23
Asia-Malaysia
Top articles of Mohd Arif Anuar Mohd Salleh
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Network Structure and Mechanical Properties of Flexible Electronic Interconnects based on Linear Low-Density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Conductive … | Journal of Electronic Materials | Khairul Anwar Abdul Halim MAA Mohd Salleh Farah Badrul Azlin Fazlina Osman Mohd Firdaus Omar | 2024/3 |
Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material | Journal of Electronic Materials | Jing Rou Lee Mun Xi Chong Mohd Sharizal Abdul Aziz Chu Yee Khor Mohd Arif Anuar Mohd Salleh | 2024/3 |
The effect of compatibiliser on the mechanical properties and electrical properties of polypropylene/carbon black (PP/CB) conductive polymer composites (CPCs) | Materials Today: Proceedings | Khairul Anwar Abdul Halim Hoe Woon Tee Farah Badrul Mohd Arif Anuar Mohd Salleh Azlin Fazlina Osman | 2024/1/16 |
Diverse material based geopolymer towards heavy metals removal: a review | Pilomeena Arokiasamy Mohd Mustafa Al Bakri Abdullah Shayfull Zamree Abd Rahim Monower Sadique Liew Yun Ming | 2023/1/1 | |
Mechanical performance, microstructure, and porosity evolution of fly ash geopolymer after ten years of curing age | Materials | Ikmal Hakem A Aziz Mohd Mustafa Al Bakri Abdullah Rafiza Abd Razak Zarina Yahya Mohd Arif Anuar Mohd Salleh | 2023/1/27 |
A SHORT REVIEW ON THE INFLUENCE OF ANTIMONY ADDITION TO THE MICROSTRUCTURE AND THERMAL PROPERTIES OF LEAD-FREE SOLDER ALLOY. | Nur Syahirah Mohamad Zaimi Mohd Arif Anuar Mohd Salleh Mohd Mustafa Al Bakri Abdullah Mohd Izrul Izwan Ramli | 2023/7/1 | |
The Phenomenon of Magnetic Anisotropy in Amorphous Materials Produced Using the Injection-Casting Method | Acta Physica Polonica A ISSN 1898-794X | M Nabiałek JJ Wysłocki T Jaruga K Błoch AV Sandu | 2023/11/1 |
Micromechanical Modeling of Polyamide 11 Nanocomposites Properties using Composite Theories | Archives of Metallurgy and Materials | Khairul Anwar Abdul Halim James E Kennedy Mohd Arif Anuar Mohd Salleh Azlin Fazlina Osman Mohd Firdaus Omar | 2023 |
Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5 Ag and Solder Joint Strength: Experimental and Finite Element Analysis | Materials | Siti Farahnabilah Muhd Amli Mohd Arif Anuar Mohd Salleh Mohd Sharizal Abdul Aziz Hideyuki Yasuda Kazuhiro Nogita | 2023/6/13 |
Multiscale Analysis of the Mechanical Properties of the Crack Tip Region | Acta Physica Polonica A ISSN 1898-794X | S Zhufeng MAA Mohd Salleh B Jeż N Yusoff | 2023/11/1 |
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium | Mohd Arif Anuar Mohd Salleh Dewi Suriyani Che Halin Kamrosni Abdul Razak Mohd Izrul Izwan Ramli | 2023 | |
Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0. 7Cu0. 05Ni Solder Joint | Materials | Aimi Noorliyana Hashim Mohd Arif Anuar Mohd Salleh Muhammad Mahyiddin Ramli Mohd Mustafa Al Bakri Abdullah Andrei Victor Sandu | 2023/2/24 |
Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows | Journal of Materials Research and Technology | MS Chang MAA Mohd Salleh DSC Halin F Somidin H Yasuda | 2023/9/1 |
Influence of sintering temperature on the pore structure of an alkali-activated kaolin based geopolymer | Archives of Metallurgy and Materials | MII Ramli MAAM Salleh IH Aziz NSM Zaimi SFM Amli | 2023 |
Alkaline-Activation Technique to Produce Low-Temperature Sintering Activated-HAp Ceramic | Applied Sciences | Wan Mohd Arif W Ibrahim Mohd Mustafa Al Bakri Abdullah Noorina Hidayu Jamil Hasmaliza Mohamad Mohd Arif Anuar Mohd Salleh | 2023/2/18 |
Reliability and failure modelling of microelectronic packages based on ultrasonic nondestructive evaluation data | NDT & E International | Haotian Wang Guang-Ming Zhang Hongwei Ma Xuhui Zhang Teresa Partida Manzanera | 2023/9/1 |
Characterization of SnO 2/TiO 2 with the Addition of Polyethylene Glycol via Sol-Gel Method for Self-Cleaning Application | Archives of Metallurgy and Materials | Dewi Suriyani Che Halin Azani Azliza Kamrosni Abdul Razak Mohd Mustafa Al Bakri Abdullah Mohd Arif Anuar Mohd Salleh | 2023 |
Effects of Diameter on Copper Pillar with Solder Cap Interconnections During Reflow Soldering Process | Jing Rou Lee Mohd Sharizal Abdul Aziz Mohd Arif Anuar Mohd Salleh Chu Yee Khor Mohammad Hafifi Hafiz Ishak | 2023/2/7 | |
The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt% Sn/Cu solder joint | Materials Science and Engineering: A | May Shin Chang MAA Mohd Salleh Flora Somidin DSC Halin Hideyuki Yasuda | 2023/8/24 |
Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0 Ag-0.5 Cu Solder Ball Joints | Key Engineering Materials | Marina Oyama Tatsuya Kobayashi Ikuo Shohji Mohd Arif Anuar Mohd Salleh | 2023/12/12 |
