JW XIAN

JW XIAN

Imperial College London

H-index: 15

Europe-United Kingdom

About JW XIAN

JW XIAN, With an exceptional h-index of 15 and a recent h-index of 15 (since 2020), a distinguished researcher at Imperial College London, specializes in the field of Intermetallics, Soldering, EBSD, Solidification, Mg alloy.

His recent articles reflect a diverse array of research interests and contributions to the field:

Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints

Facets Formation of Ag3Sn Intermetallic in Sn-Bi-Ag Alloys: An EBSD and First-Principles Study

Ag3Sn Morphology Transitions During Eutectic Growth in Sn–Ag Alloys

Microstructure effects on the thermal fatigue of solder joints: coupling damage measurements with multi-scale modelling

Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys

Eutectic solidification in Mg-9Al-0.7 Zn: From divorced to coupled growth

Al-Mn Intermetallics in High Pressure Die Cast AZ91 and Direct Chill Cast AZ80

Multi-scale plasticity homogenization of Sn–3Ag-0.5 Cu: From β-Sn micropillars to polycrystals with intermetallics

JW XIAN Information

University

Position

___

Citations(all)

836

Citations(since 2020)

624

Cited By

422

hIndex(all)

15

hIndex(since 2020)

15

i10Index(all)

21

i10Index(since 2020)

18

Email

University Profile Page

Imperial College London

Google Scholar

View Google Scholar Profile

JW XIAN Skills & Research Interests

Intermetallics

Soldering

EBSD

Solidification

Mg alloy

Top articles of JW XIAN

Title

Journal

Author(s)

Publication Date

Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints

Journal of the Mechanics and Physics of Solids

Yilun Xu

Jingwei Xian

Richard J Coyle

Christopher M Gourlay

Fionn PE Dunne

2024/6/1

Facets Formation of Ag3Sn Intermetallic in Sn-Bi-Ag Alloys: An EBSD and First-Principles Study

JOM

JL Liao

XJ Hu

YR Wang

W Sun

GY Mi

...

2024/4/3

Ag3Sn Morphology Transitions During Eutectic Growth in Sn–Ag Alloys

Metallurgical and Materials Transactions A

N Hou

JW Xian

A Sugiyama

H Yasuda

CM Gourlay

2023/3

Microstructure effects on the thermal fatigue of solder joints: coupling damage measurements with multi-scale modelling

arXiv preprint arXiv:2311.03891

JW Xian

YL Xu

S Stoyanov

RJ Coyle

FPE Dunne

...

2023/11/7

Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys

Acta Materialia

Y Cui

JW Xian

A Zois

K Marquardt

H Yasuda

...

2023/5/1

Eutectic solidification in Mg-9Al-0.7 Zn: From divorced to coupled growth

Journal of Alloys and Compounds

Cheng-Jung Lin

Liuqing Peng

JW Xian

Qianqian Li

CM Gourlay

2023/3/25

Al-Mn Intermetallics in High Pressure Die Cast AZ91 and Direct Chill Cast AZ80

Metals

Liuqing Peng

Guang Zeng

Di Wang

Jingwei Xian

Shouxun Ji

...

2022/2

Multi-scale plasticity homogenization of Sn–3Ag-0.5 Cu: From β-Sn micropillars to polycrystals with intermetallics

Materials Science and Engineering: A

Yilun Xu

Tianhong Gu

Jingwei Xian

Finn Giuliani

T Ben Britton

...

2022/10/10

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

International Journal of Plasticity

Yilun Xu

Jingwei Xian

Stoyan Stoyanov

Chris Bailey

Richard J Coyle

...

2022/8/1

Eutectic intermetallic formation during solidification of a Mg-Sn-Al-Zn-Mn alloy

Materials Characterization

Yangchao Deng

Guang Zeng

Jingwei Xian

Hongyi Zhan

Chuming Liu

...

2022/4/1

Al–Mn–Fe intermetallic formation in AZ91 magnesium alloys: Effects of impurity iron

Intermetallics

L Peng

G Zeng

J Xian

CM Gourlay

2022/3/1

Al11Mn4 formation on Al8Mn5 during the solidification and heat treatment of AZ-series magnesium alloys

Materialia

JW Xian

L Peng

G Zeng

D Wang

CM Gourlay

2021/9/1

Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony

Journal of Electronic Materials

SA Belyakov

RJ Coyle

B Arfaei

JW Xian

CM Gourlay

2021/3

Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints

Journal of Electronic Materials

JW Xian

SA Belyakov

CM Gourlay

2021/3

Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5 Cu solder

International Journal of Plasticity

Yilun Xu

Tianhong Gu

Jingwei Xian

Finn Giuliani

T Ben Britton

...

2021/2

Al8Mn5 in High-Pressure Die Cast AZ91: Twinning, Morphology and Size Distributions

Metallurgical and Materials Transactions A

G Zeng

SS Shuai

XZ Zhu

SX Ji

JW Xian

...

2020/5

See List of Professors in JW XIAN University(Imperial College London)

Co-Authors

H-index: 42
Christopher M. Gourlay

Christopher M. Gourlay

Imperial College London

H-index: 26
Guang Zeng

Guang Zeng

Central South University

H-index: 23
Mohd Arif Anuar Mohd Salleh

Mohd Arif Anuar Mohd Salleh

Universiti Malaysia Perlis

H-index: 22
Sergey Belyakov

Sergey Belyakov

Imperial College London

H-index: 18
Z.L. Ma

Z.L. Ma

Beijing Institute of Technology

H-index: 15
Yilun Xu

Yilun Xu

Imperial College London

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