Ganesh Subbarayan
Purdue University
H-index: 28
North America-United States
Top articles of Ganesh Subbarayan
In-Line Test Structures and Non-destructive Characterization of Electromigration-Driven Phase Evolution in Microscale Solder Joints
Journal of Electronic Materials
2024/4/17
Ganesh Subbarayan
H-Index: 14
A Noncontact Method for Estimating Thin Metal Film Adhesion Strength Through Current-Induced Void Growth
Journal of Applied Mechanics
2024/4
Yuvraj Singh
H-Index: 1
Ganesh Subbarayan
H-Index: 14
Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys
Journal of Electronic Materials
2024/3
Ganesh Subbarayan
H-Index: 14
Stereological Analysis of Microstructural Evolution Due to Aging in SnAgCu Solder Alloys
Journal of Electronic Materials
2024/1/10
Real-Time Precision Prediction of 3-D Package Thermal Maps via Image-to-Image Translation
2023/10/15
Vinicius Cabral Do Nascimento
H-Index: 2
Qiang Qiu
H-Index: 22
Ganesh Subbarayan
H-Index: 14
Dan Jiao
H-Index: 18
In Situ Study on Cu-to-Cu Thermal Compression Bonding
Crystals
2023/6/21
Ke Xu
H-Index: 29
Chao Shen
H-Index: 9
Tianyi Sun
H-Index: 8
Ganesh Subbarayan
H-Index: 14
Haiyan Wang
H-Index: 7
Xinghang Zhang
H-Index: 48
Modeling of Heterogeneously Integrated Systems: Challenges and Strategies for Rapid Design Exploration
2023/6/11
Comparative mechanical behavior of Sn-Bi based low temperature solder alloys under different pretest aging conditions
2023/5/30
John Blendell
H-Index: 19
Carol Handwerker
H-Index: 19
Ganesh Subbarayan
H-Index: 14
Nilesh Badwe
H-Index: 5
Squeeze Flow and Thermal Resistance Characterization of Thermal Interface Materials
2023/5/30
Ganesh Subbarayan
H-Index: 14
Test device design and test procedure for non-destructive characterization of Bi phase accumulation during electromigration
2023/5/30
Carol Handwerker
H-Index: 19
Ganesh Subbarayan
H-Index: 14
The Connection between Electromigration Resistance and Thin Film Adhesion and their Degradation with Temperature
IEEE Transactions on Components, Packaging and Manufacturing Technology
2023/3/20
Historical purview and recent advances in fracture mechanics of elastomeric matrix composites
2022/11/2
Mohit Goswami
H-Index: 2
Sujit Sharma
H-Index: 2
Ganesh Subbarayan
H-Index: 14
Santanu Chattopadhyay
H-Index: 16
Conservation laws for arbitrary objectives with application to fracture resistant design
International Journal of Fracture
2022/11
(Invited) Reaction-Diffusion Modeling for Reliability Assessment of Heterogeneously Integrated Packages
Electrochemical Society Meeting Abstracts 242
2022/10/9
Ganesh Subbarayan
H-Index: 14
Efficient Local Refinement near Parametric Boundaries Using kd-Tree Data Structure and Algebraic Level Sets
Algorithms
2022/7/13
Tao Song
H-Index: 26
Ganesh Subbarayan
H-Index: 14
Phase Field Simulations of Solder Void Evolution under Thermal Aging
2022/5/31
Ganesh Subbarayan
H-Index: 14
Novel test device for non-destructive experimental characterization of void evolution in microscale solder joints subjected to thermal aging
2022/5/31
Ganesh Subbarayan
H-Index: 14
Finite Element Modeling Strategies for Studying Mechanical Design Tradeoffs in Heterogeneously Integrated Packages
2022/5/31
Non-Intrusive Two-Way Coupling for Multiscale Analysis of Electronic Packages
2022/5/31
Sai Sanjit Ganti
H-Index: 1
Ganesh Subbarayan
H-Index: 14
