John Blendell
Purdue University
H-index: 35
North America-United States
Top articles of John Blendell
Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys
Journal of Electronic Materials
2024/3
Effect of Sb and Ag additions on the melting and solidification of Sn-Bi solder alloys
MRS Advances
2024/2
Whisker Nucleation by Slip-Assisted Grain Rotation During Thermal Cycling
JOM
2024/1/25
Sb additions in near-eutectic Sn-Bi solder decrease planar slip
Journal of Electronic Materials
2023/11
Microalloying effects of Sb and Ag on the microstructural evolution of eutectic Sn–Bi alloys
MRS Advances
2023/10
John Blendell
H-Index: 19
Comparative mechanical behavior of Sn-Bi based low temperature solder alloys under different pretest aging conditions
2023/5/30
John Blendell
H-Index: 19
Carol Handwerker
H-Index: 19
Ganesh Subbarayan
H-Index: 14
Nilesh Badwe
H-Index: 5
Interfacial and volumetric melting regimes of Sn nanoparticles
Acta Materialia
2022/8/15
Hillock formation in β-Sn films during high frequency cyclic bending at low strains
Thin Solid Films
2022/1/1
Influence of pad surface finish on the microstructure evolution and intermetallic compound growth in homogeneous Sn-Bi and Sn-Bi-Ag solder interconnects
Journal of Electronic Materials
2021/12
Equilibrium and kinetic shapes of grains in polycrystals
Acta Materialia
2020/6/1
Grain growth in Nio–MgO and its dependence on faceting and the equilibrium crystal shape
Scripta materialia
2020/3/15
Origin of grain size effects on voltage‐driven ferroelastic domain evolution in polycrystalline tetragonal lead zirconate titanate thin film
Advanced Functional Materials
2020/2
Local variations in grain formation, grain boundary sliding, and whisker growth along grain boundaries in large-grain Sn films
Scripta Materialia
2020/10/1
Barkhausen noise analysis of thin film ferroelectrics
Applied Physics Letters
2020/7/6
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