Dr. Hajdin Ceric

About Dr. Hajdin Ceric

Dr. Hajdin Ceric, With an exceptional h-index of 16 and a recent h-index of 10 (since 2020), a distinguished researcher at Technische Universität Wien, specializes in the field of electromigration, modeling, simulation, interconnects.

His recent articles reflect a diverse array of research interests and contributions to the field:

Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds

Microstructural impact on electromigration reliability of gold interconnects

A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability

Statistical study of electromigration in gold interconnects

Impact of via geometry and line extension on via-electromigration in nano-interconnects

Impact of Gold Interconnect Microstructure on Electromigration Failure Time Statistics

Dynamics of electromigration voids in Cu interconnects: Investigation using a physics-based model augmented by neural networks

Electromigration Degradation of Gold Interconnects: A Statistical Study

Dr. Hajdin Ceric Information

University

Position

Institut für Mikroelektronik

Citations(all)

1254

Citations(since 2020)

405

Cited By

1044

hIndex(all)

16

hIndex(since 2020)

10

i10Index(all)

23

i10Index(since 2020)

10

Email

University Profile Page

Google Scholar

Dr. Hajdin Ceric Skills & Research Interests

electromigration

modeling

simulation

interconnects

Top articles of Dr. Hajdin Ceric

Title

Journal

Author(s)

Publication Date

Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds

Journal of Applied Physics

Hajdin Ceric

Houman Zahedmanesh

Kristof Croes

Roberto Lacerda de Orio

Siegfried Selberherr

2023/3/14

Microstructural impact on electromigration reliability of gold interconnects

Solid-State Electronics

Hajdin Ceric

RL de Orio

Siegfried Selberherr

2023/2/1

A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability

Journal of Applied Physics

AS Saleh

K Croes

H Ceric

I De Wolf

H Zahedmanesh

2023/10/7

Statistical study of electromigration in gold interconnects

Microelectronics Reliability

Hajdin Ceric

Roberto Lacerda de Orio

Siegfried Selberherr

2023/8/1

Impact of via geometry and line extension on via-electromigration in nano-interconnects

Ahmed S Saleh

Houman Zahedmanesh

Hajdin Ceric

Ingrid De Wolf

Kris Croes

2023/3/26

Impact of Gold Interconnect Microstructure on Electromigration Failure Time Statistics

Hajdin Ceric

Roberto Lacerda de Orio

Siegfried Selberherr

2022/9/19

Dynamics of electromigration voids in Cu interconnects: Investigation using a physics-based model augmented by neural networks

AS Saleh

Houman Zahedmanesh

Hajdin Ceric

Kristof Croes

I De Wolf

2022/6/27

Electromigration Degradation of Gold Interconnects: A Statistical Study

Hajdin Ceric

RL de Orio

Siegfried Selberherr

2022/6/27

Void-dynamics in nano-wires and the role of microstructure investigated via a multi-scale physics-based model

Journal of Applied Physics

AS Saleh

Hajdin Ceric

H Zahednamesh

2021/3/28

Modeling methods for analysis of electromigration degradation in nano-interconnects

ECS Journal of Solid State Science and Technology

Hajdin Ceric

Siegfried Selberherr

Houman Zahedmanesh

RL de Orio

Kristof Croes

2021/3/4

Models and Techniques for Reliability Studies of Nano-scaled Interconnects

A} dvances in {M} easurements and {I} nstrumentation:{R} eviews}

Hajdin Ceric

Houman Zahedmanesh

Roberto Lacerda de Orio

Siegfried Selberherr

2021

See List of Professors in Dr. Hajdin Ceric University(Technische Universität Wien)