Chris Bailey

Chris Bailey

University of Greenwich

H-index: 33

Europe-United Kingdom

About Chris Bailey

Chris Bailey, With an exceptional h-index of 33 and a recent h-index of 17 (since 2020), a distinguished researcher at University of Greenwich, specializes in the field of Electronics Packaging, Multi-Physics Modelling, Reliability.

His recent articles reflect a diverse array of research interests and contributions to the field:

Damage mechanics-based failure prediction of wirebond in power electronic module

Modelling Insights into the Assembly Challenges of Focal Plane Arrays

Advantages of the extended finite element method for the analysis of crack propagation in power modules

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

Deep learning modelling for composite properties of pcb conductive layers

Modeling for assessing Semiconductor Packages in High-Reliability Applications

Applying Model Order Reduction to the Reliability Prediction of Power Electronic Module Wirebond Structure

Comparative reliability of inkjet-printed electronics packaging

Chris Bailey Information

University

Position

___

Citations(all)

4480

Citations(since 2020)

1414

Cited By

3626

hIndex(all)

33

hIndex(since 2020)

17

i10Index(all)

109

i10Index(since 2020)

41

Email

University Profile Page

University of Greenwich

Google Scholar

View Google Scholar Profile

Chris Bailey Skills & Research Interests

Electronics Packaging

Multi-Physics Modelling

Reliability

Top articles of Chris Bailey

Title

Journal

Author(s)

Publication Date

Damage mechanics-based failure prediction of wirebond in power electronic module

IEEE Access

Pushpa Rajaguru

Tim Tilford

Chris Bailey

Stoyan Stoyanov

2023/12/13

Modelling Insights into the Assembly Challenges of Focal Plane Arrays

IEEE Access

Stoyan Stoyanov

Chris Bailey

2023/4/5

Advantages of the extended finite element method for the analysis of crack propagation in power modules

Power Electronic Devices and Components

Kenneth Chimezie Nwanoro

Hua Lu

Chunyan Yin

Chris Bailey

2023/3/1

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

International Journal of Plasticity

Yilun Xu

Jingwei Xian

Stoyan Stoyanov

Chris Bailey

Richard J Coyle

...

2022/8/1

Deep learning modelling for composite properties of pcb conductive layers

Stoyan Stoyanov

Chris Bailey

2022/4/25

Modeling for assessing Semiconductor Packages in High-Reliability Applications

Chris Bailey

2021/4/8

Applying Model Order Reduction to the Reliability Prediction of Power Electronic Module Wirebond Structure

Pushpa Rajaguru

Martina Bella

Chris Bailey

2021/9/23

Comparative reliability of inkjet-printed electronics packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology

Tim Tilford

Stoyan Stoyanov

Jessica Braun

Jan Christoph Janhsen

Mayur K Patel

...

2021/1/8

Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications

Stoyan Stoyanov

Paul Stewart

Chris Bailey

2021/9/13

Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks

International Journal of Numerical Methods for Heat & Fluid Flow

Chris Bailey Mani Sekaran Santhanakrishnan

Tim Tilford

2021/7/16

Review of Fusion Prognostics for Lithium-Ion Batteries-Current State and Future Challenges

Nneka Daniel

Stoyan Stoyanov

Chris Bailey

David Flynn

2021/5/5

Improved Battery Degradation Modelling with Coupled Physical and Machine Learning Modelling

Nneka Daniel

Stoyan Stoyanov

Chris Bailey

David Flynn

2021/5/5

Developing computational intelligence for smart qualification testing of electronic products

IEEE Access

Mominul Ahsan

Stoyan Stoyanov

Chris Bailey

Alhussein Albarbar

2020/1/20

Failure mode & effect analysis and another methodology for improving data veracity and validity

Annals of Emerging Technologies in Computing (AETiC), Print ISSN

Ana Elsa Hinojosa Herrera

Chris Walshaw

Chris Bailey

2020/7/1

Modelling and analysis of vibration on power electronic module structure and application of model order reduction

Microelectronics Reliability

P. Rajaguru

H. Lu

C. Bailey

M. Bella

2020/7

Experimental and Modeling Study on Delamination Risks for Refinished Electronic Packages Under Hot Solder Dip Loads

IEEE Transactions on Components, Packaging and Manufacturing Technology

Stoyan Stoyanov

Chris Bailey

Paul Stewart

Mike Parker

John F Roulston

2020/2/12

Improving Black Box Classification Model Veracity for Electronics Anomaly Detection

Ana Elsa Hinojosa Herrera

Chris Walshaw

Chris Bailey

2020/11/9

Advances in Power Electronics

Chris Bailey

2020/2/10

Reliability impact of assembly materials for Micro-BGA components in high reliability applications

Stoyan Stoyanov

Chris Bailey

Paul Stewart

Graeme Morrison

2020/9/15

An analysis of the thermal interaction between components in power converter applications

IEEE Transactions on Power Electronics

Mohammad Shahjalal

Md Rishad Ahmed

Hua Lu

Chris Bailey

Andrew J Forsyth

2020/1/27

See List of Professors in Chris Bailey University(University of Greenwich)

Co-Authors

H-index: 64
Y C Chan

Y C Chan

City University of Hong Kong

H-index: 52
Mark Cross

Mark Cross

Swansea University

H-index: 41
Koulis Pericleous

Koulis Pericleous

University of Greenwich

H-index: 37
Gareth Taylor

Gareth Taylor

Brunel University London

H-index: 37
Marc Desmulliez

Marc Desmulliez

Heriot-Watt University

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