Y C Chan
City University of Hong Kong
H-index: 64
Asia-Hong Kong
Top articles of Y C Chan
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Electromigration-induced microstructure evolution and failure mechanism of sintered nano-Ag joint | Materials Characterization | Zhi Jin Fupeng Huo Jianhao Wang Xunda Liu YC Chan | 2023/11/1 |
Practical study to demonstrate an increase in the reliability of flip chip connections by adding nanoparticles to solder | David M Harvey Teresa Partida Manzanera Kangkana Baishya Guangming Zhang Mohd Arif Anuar Mohd Salleh Arif | 2023/9/11 | |
The electromigration study of thin-film structured Sn3. 5Ag and Ag using continuous observation and reliability enhancement approach | Thin Solid Films | Zhi Jin Fupeng Huo Duy Le Han Xunda Liu Hiroaki Tatsumi | 2023/6/1 |
Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods | Scientific Reports | Zhi Jin Yu-An Shen Yang Zuo YC Chan SH Mannan | 2021/4/21 |
Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn–58Bi solders with Ni substrates | International Journal of Materials Research | MY Chiu SY Chang YH Tseng YC Chan TH Chuang | 2021/12/27 |
Intermetallic compounds formed during the soldering reactions of eutectic Sn–9Zn with Cu and Ni substrates | International Journal of Materials Research | YC Chan MY Chiu TH Chuang | 2021/12/27 |
Electromigration behavior of silver thin film fabricated by electron-beam physical vapor deposition | Journal of Materials Science | Zhi Jin Yu-An Shen Fupeng Huo YC Chan Hiroshi Nishikawa | 2021/6 |
Semi In-Situ Observation on Void Formation in Electromigrated Sn-Ag Film and its Prediction by Random-Walk Simulation | Yang and Chan, YC and Mannan, SH and Nishikawa, Hiroshi, Semi In-Situ Observation on Void Formation in Electromigrated Sn-Ag Film and its Prediction by Random-Walk Simulation | Zhi Jin Yu-An Shen Yang Zuo YC Chan SH Mannan | 2020 |
