Abhijit Dasgupta
University of Maryland
H-index: 45
North America-United States
Top articles of Abhijit Dasgupta
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Modelling recrystallizaton in oligocrystalline SnAgCu solder joint under cyclic loading condition | Yaxiong Chen Torsten Hauck Aniket Bharamgonda Abhijit Dasgupta | 2024/4/7 | |
Prediction of Variability in Vibration Durability of Oligocrystalline SnAgCu Solder Joints | Aniket Bharamgonda Idowu Olatunji Xiao Lin Abhijit Dasgupta Yaxiong Chen | 2024/4/7 | |
Flexible and Twistable Free-Standing PDMS-Magnetic-Nanoparticle-based Soft Magnetic Films with Robust Magnetic Properties | Flexible and Printed Electronics | Swarup Kumar Subudhi Beihan Zhao Xinjun Wang John Ting Ichiro Takeuchi | 2024/2/27 |
Printed carbon nanotube-based humidity sensors deployable on surfaces of widely varying curvatures | ACS Applied Nano Materials | Beihan Zhao Vishal Sankar Sivasankar Swarup Kumar Subudhi Abhijit Dasgupta Siddhartha Das | 2023/1/16 |
Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels | Hayden Richards Hisham Abusalma Abhijit Dasgupta Jian Yu Andres Bujanda | 2023/10/24 | |
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes | Hisham Abusalma Hayden Richards Abhijit Dasgupta Andres Bujanda Jian Yu | 2023/10/24 | |
Direct visualization of nanoparticle morphology in thermally sintered nanoparticle ink traces and the relationship among nanoparticle morphology, incomplete polymer removal … | Nanotechnology | Ghansham Rajendrasingh Chandel Jiayue Sun Sai Ankit Etha Beihan Zhao Vishal Sankar Sivasankar | 2023/6/19 |
In Situ Monitoring of Creep Deformation in Single Crystal SAC305 Solder Joint at Different Temperatures | Aniket Bharamgonda Abhishek Deshpande Abhijit Dasgupta | 2023/5/30 | |
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits | Journal of Electronic Packaging | Beihan Zhao Aniket Bharamgonda Edwin Quinn George Stackhouse Jason Fleischer | 2023/12/1 |
Effect of Elastic-Plastic Anisotropy of Solder Grains on Variability of Cyclic Mechanical Bending Durability in SAC305 CSP Assembly | Aniket Bharamgonda Abhijit Dasgupta Abhishek Deshpande Torsten Hauck Yaxiong Chen | 2023/4/16 | |
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals | Journal of Electronic Packaging | Abhishek Deshpande Aniket Bharamgonda Qian Jiang Abhijit Dasgupta | 2023/12/1 |
Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints | Abhishek Deshpande Qian Jiang Abhijit Dasgupta | 2022/10/25 | |
Durability of Copper Traces in Ball Grid Array (BGA) Assemblies under Sequential Harmonic Vibration and Temperature Cycling | Idowu Olatunji Abhishek Deshpande Manuel Bascolo Abhijit Dasgupta Ulrich Becker | 2022/4/25 | |
Role of nominal stress state on cyclic fatigue durability of SAC305 grain-scale solder joints | Journal of Electronic Packaging | Abhishek Deshpande Qian Jiang Abhijit Dasgupta Ulrich Becker | 2022/9/1 |
Effect of temperature on vibration durability of lead-free solder joints | Microelectronics Reliability | Robert Höhne Karsten Meier Abhijit Dasgupta David Leslie Maximilian Ochmann | 2022/12/1 |
Applications, fluid mechanics, and colloidal science of carbon-nanotube-based 3D printable inks | Beihan Zhao Vishal Sankar Sivasankar Swarup Kumar Subudhi Shayandev Sinha Abhijit Dasgupta | 2022 | |
Multi-scale crystal viscoplasticity approach for estimating anisotropic steady-state creep properties of single-crystal SnAgCu alloys | International Journal of Plasticity | Q Jiang A Deshpande A Dasgupta | 2022/6/1 |
Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods | Beihan Zhao Aniket Ajitkumar Bharamgonda Eric Jennings Robert G Utter Michael Osterman | 2022/10/25 | |
Copper trace failures in ball grid array (BGA) packages under sequential harmonic vibration and temperature cycling | Abhishek Deshpande Idowu Olatunji Manuel Bascolo Abhijit Dasgupta Ulrich Becker | 2022/5/31 | |
Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods | David Leslie Abhijit Dasgupta Andrei Damian | 2022/10/25 |
Co-Authors
