Bongtae Han
University of Maryland
H-index: 39
North America-United States
Top articles of Bongtae Han
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Deterministic Approach to Obtain Autocatalytic Cure Kinetics Model Constants by Normal Equations of Least-Squares Method | IEEE Transactions on Components, Packaging and Manufacturing Technology | Sukrut Prashant Phansalkar Bongtae Han | 2024/3/26 |
Time-dependent Bulk Behavior of Cured Epoxy Molding Compound | Sukrut Prashant Phansalkar Roshith Mittakolu Bongtae Han | 2023/5/30 | |
Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction | Ran Tao Sukrut Prashant Phansalkar Aaron M Forster Bongtae Han | 2023/5/30 | |
Thermal aging study of encapsulated power devices under autonomous driving condition and its effect on board level reliability | Yu-Hsiang Yang Bongtae Han Przemyslaw Gromala | 2023/5/30 | |
Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations | Yongrae Jang Yu-Hsiang Yang Bongtae Han You-Gwon Kim Hak-Sung Kim | 2023/5/30 | |
Effect of critical properties of epoxy molding compound on warpage prediction: A critical review | Sukrut Prashant Phansalkar Changsu Kim Bongtae Han | 2022/3/1 | |
Measurement of effective cure shrinkage of epoxy‐based molding compound by fiber Bragg grating sensor using two‐stage curing process | Journal of Applied Polymer Science | Changsu Kim Sukrut Prashant Phansalkar Hyun‐Seop Lee Bongtae Han | 2022/2/10 |
EMC Oxidation Under High-Temperature Aging | A Inamdar P Gromala Alexandru Prisacaru Alexander Kabakchiev Y Yang | 2022/1/31 | |
On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA) | Sukrut Prashant Phansalkar Bongtae Han Ehsan Akbari Paulius Vaitiekunas | 2022/10/25 | |
High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package | Polymer Degradation and Stability | Adwait Inamdar Yu-Hsiang Yang Alexandru Prisacaru Przemyslaw Gromala Bongtae Han | 2021/6/1 |
Towards virtual twin for electronic packages in automotive applications | Microelectronics Reliability | Alexandru Prisacaru Ernesto Oquelis Guerrero Balakrishna Chimmineni Przemyslaw Jakub Gromala Yu-Hsiang Yang | 2021/7/1 |
Degradation estimation and prediction of electronic packages using data-driven approach | IEEE transactions on industrial electronics | Alexandru Prisacaru Przemyslaw Gromala Bongtae Han Guo Qi Zhang | 2021/3/30 |
Why is it still difficult to make accurate prediction of the warpage after advanced molding processes? | Sukrut Phansalkar Changsu Kim Bongtae Han | 2021/6/1 | |
Thermal and optical performance of cryogenically cooled laser diode bars mounted on pin-finned microcoolers | Applied Physics B | KJ Kim B Han A Bar-Cohen | 2021/3 |
Machine learning based meta-models for sensorless thermal load prediction | Daniel Riegel Przemyslaw Jakub Gromala Bongtae Han Sven Rzepka | 2021/6/1 | |
Thermal Performance of Cryogenic Micro-Pin Fin Coolers with Two-Phase Liquid Nitrogen Flows | Applied Sciences | Kyoung Joon Kim Hyeon Ho Yang Wooheon Noh Bongtae Han Avram Bar-Cohen | 2021/11/22 |
Mechanical Characterization of Benzene cyclobutene (BCB) Used in Cu/polymer Hybrid Bonding | Sukrut Prashant Phansalkar Yu-Hsiang Yang Changsu Kim Bongtae Han Young Kun Jee | 2021/6/1 | |
Implementation and Performance Evaluation of a Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables | Materials | Yu-Hsiang Yang Hsiu-Ping Wei Bongtae Han Chao Hu | 2021/8/17 |
Data-Driven Remaining Useful Life Prediction of QFN Packages on Board Level with On-Chip Stress Sensors | Daniel Riegel Przemyslaw Jakub Gromala Bongtae Han Sven Rzepka | 2021/6/1 | |
Mechanical Characterization of Dual Curable Adhesives | Sukrut Phansalkar Changsu Kim Bongtae Han | 2020/6/3 |
