Vesa Vuorinen
Aalto-yliopisto
H-index: 26
Europe-Finland
Top articles of Vesa Vuorinen
Bonding of ceramics to silver‐coated titanium—A combined theoretical and experimental study
Journal of Biomedical Materials Research Part B: Applied Biomaterials
2024/5
Vesa Vuorinen
H-Index: 18
Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability
2024/4/18
Fahimeh Emadi
H-Index: 2
Vesa Vuorinen
H-Index: 18
Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
Microelectronic Engineering
2024/3/1
Vesa Vuorinen
H-Index: 18
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Materials Characterization
2024/2/20
Vesa Vuorinen
H-Index: 18
Sami Suihkonen
H-Index: 17
Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
2023/9/29
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
Materials Science and Engineering: A
2023/8/10
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150° C
Scripta Materialia
2023/1/1
Vesa Vuorinen
H-Index: 18
Nikhilendu Tiwary
H-Index: 4
Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer
Journal of Composites Science
2023/10/30
Impact of inherent design limitations for Cu–Sn SLID microbumps on its electromigration reliability for 3D ICs
IEEE Transactions on Electron Devices
2022/12/5
Nikhilendu Tiwary
H-Index: 4
Vesa Vuorinen
H-Index: 18
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
2022/10/23
Aluminium corrosion in power semiconductor devices
Microelectronics Reliability
2022/10/1
Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging
2022/9/13
Fahimeh Emadi
H-Index: 2
Vesa Vuorinen
H-Index: 18
Joint International Master in Smart Systems Integrated Solutions
2022/9/13
Finite element simulation of solid-liquid interdiffusion bonding process
2022/5/1
Nikhilendu Tiwary
H-Index: 4
Vesa Vuorinen
H-Index: 18
Finite element simulation of solid–liquid interdiffusion bonding process: Understanding process-dependent thermomechanical stress
IEEE Transactions on Components, Packaging and Manufacturing Technology
2022/4/25
Nikhilendu Tiwary
H-Index: 4
Vesa Vuorinen
H-Index: 18
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
Journal of Alloys and Compounds
2022/1/15
A humidity-induced novel failure mechanism in power semiconductor diodes
Microelectronics Reliability
2021/8/1
Wafer level solid liquid Interdiffusion bonding: formation and evolution of microstructures
Journal of Electronic Materials
2021/3
Vesa Vuorinen
H-Index: 18
Wafer Level Solid Liquid Interdiffusion Bonding
2021
Low-temperature Metal Bonding for Optical Device Packaging
2021/9/13
Vesa Vuorinen
H-Index: 18
Nikhilendu Tiwary
H-Index: 4
