seung-boo jung
Sungkyunkwan University
H-index: 59
Asia-South Korea
Top articles of seung-boo jung
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Effect of thickness in the SAC 305 plated layer on the interfacial reaction and mechanical properties of the CCSB joint assembled onto the OSP surface finished FR-4 PCB board | Journal of Materials Science: Materials in Electronics | Jae-yeol Son Donggil Kang Haksan Jeong Seung-Boo Jung | 2024/3 |
Low-melting metal thermal interface material for high-power package application | Journal of the Korean Physical Society | Mikyeong Choi Seung-Boo Jung | 2023/9 |
Correction to “Role of Oxygen in the Ti3AlC2 MAX Phase in the Oxide Formation and Conductivity of Ti3C2-Based MXene Nanosheets” | ACS Applied Materials & Interfaces | Su Bin Choi Jung-Min Oh Jagan Singh Meena Hanjung Kwon Seung-Boo Jung | 2023/4/26 |
Proposal of intense pulsed light soldering process for improving the drop impact reliability of Sn–3.0 Ag–0.5 Cu ball grid array package | Journal of Manufacturing Processes | Kyung Deuk Min Eun Ha Sinyeob Lee Jae-Seon Hwang Taegyu Kang | 2023/7/28 |
Water‐Triggered Self‐Healing of Ti3C2Tx MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process | Small | Jun Sang Choi Jagan Singh Meena Su Bin Choi Seung‐Boo Jung Jong‐Woong Kim | 2023/12/28 |
Electronic textiles: New age of wearable technology for healthcare and fitness solutions | Jagan Singh Meena Su Bin Choi Seung-Boo Jung Jong-Woong Kim | 2023/4/1 | |
Self-repairing and energy-harvesting triboelectric sensor for tracking limb motion and identifying breathing patterns | ACS Applied Materials & Interfaces | Jagan Singh Meena Tran Duc Khanh Seung-Boo Jung Jong-Woong Kim | 2023/6/9 |
Modifying of solder composition as MXT03 for high TC reliability on Cu-OSP by optimized elements in Sn-Ag-Cu-Ni-Bi system | JY Son SG Lee YW Lee SB Jung | 2023/12/5 | |
Role of Oxygen in the Ti3AlC2 MAX Phase in the Oxide Formation and Conductivity of Ti3C2-Based MXene Nanosheets | ACS Applied Materials & Interfaces | Su Bin Choi Jung-Min Oh Jagan Singh Meena Hanjung Kwon Seung-Boo Jung | 2023/2/2 |
Enhancement of Ga-21.5 In-10 Sn Eutectic Alloy Based Thermal Interface Material Incorporating Cu Flake | Jang Baeg Kim Dong Gil Kang Taejoon Noh Seahwan Kim Seung-Boo Jung | 2023/5/30 | |
Enhancement of Thermal cycle and Drop Shock Reliability at Board Level with Developed Solder Composition by Optimized Bi, Cu, Ni Contents in Lead Free Solder Composition | JY Son SG Lee JW Park YW Lee SB Jung | 2023/10/25 | |
Effect of Ceramic Filler in Epoxy Mold Compound on Thermomechanical Property of FOWLP | Taejoon Noh Haksan Jeong Seung-boo Jung | 2023/5/30 | |
Advances in Silver Nanowires‐Based Composite Electrodes: Materials Processing, Fabrication, and Applications | Jagan Singh Meena Su Bin Choi Seung‐Boo Jung Jong‐Woong Kim | 2023/10 | |
Intense Pulsed Light Soldering of Sn–3.0 Ag–0.5 Cu Ball Grid Array Component on Au/Pd (P)/Ni (P) Surface‐Finished Printed Circuit Board and Its Drop Impact Reliability | Advanced Engineering Materials | Eun Ha Kyung Deuk Min Sinyeob Lee Jae-Seon Hwang Taegyu Kang | 2023/5 |
Effect of microstructural variation on the Cu/CK45 carbon steel friction weld joint | International Journal of Materials Research | WB Lee SB Jung | 2022/2/3 |
RF characterization in range of 18GHz in fan-out package structure molded by epoxy molding compound with EMI shielding property | Eun Ha Haksan Jeong Kyung Deuk Min Kyung-Yeol Kim Seung-Boo Jung | 2022/5/31 | |
Investigation of interfacial reactions between Sn–Ag–Bi–in solder and (Cu, electroless Ni–P/Cu) substrate | International Journal of Materials Research | Jeong-Won Yoon Chang-Yong Lee Chang-Bae Lee Choong-Sik Yoo Seung-Boo Jung | 2022/2/3 |
Mechanical properties and microstructures of Cu/In-48Sn alloy/Cu with low temperature TLP bonding | Dong Gil Kang Kyung Deuk Min Hak San Jung Eun Ha Kyung Yeol Kim | 2022/5/31 | |
Interfacial reaction and shear strength of Sn–0.7 Cu solder/electrolytic Ni joints with reflow time | International Journal of Materials Research | Jeong-Won Yoon Seung-Boo Jung | 2022/2/2 |
Evaluation on bonding reliability of SAC305/Sn-57.5 Bi-0.4 Ag BGA solder joints with drop impact test | Geunsik Oh Kyung Deuk Min Eun Ha Seung-Boo Jung | 2022/5/31 |
Co-Authors
