Sa'd M Hamasha
Auburn University
H-index: 25
North America-United States
Top articles of Sa'd M Hamasha
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
The impact of Bi content on the coarsening kinetics of IMC particles and creep deformation under thermal cycling | Journal of Electronic Materials | Mohamed El Amine Belhadi Sa’d Hamasha Ali Alahmer Rong Zhao Barton C Prorok | 2024/1 |
Power Law Creep Behavior Model Of 3rd Generation Lead-Free Alloys Considering Isothermal Aging | Journal of Electronic Packaging | Mohamed Belhadi Sa' Hamasha Ali Alahmer Xin Wei Abdallah Alakayleh | 2024/3/1 |
Impact of isothermal aging on mechanical properties of 92.8% Sn-3% Ag-0.5% Cu-3.3% Bi (cyclomax) solder joints | Metals | Mohammad M Hamasha Khozima Hamasha Sa’d Hamasha | 2023/3/14 |
Effects of multiple reflows on IMC and shear strength of individual solder joints | Sufyan Tahat Abdallah Alakayleh Mohamed El Amine Belhadi Ali Alahmar Alyssa Yaeger | 2023/5/30 | |
Evaluating a Hospital Smart Notification System in a Simulated Environment: The Method | Haneen Ali Yasin Fatemi Miranda Batchelor Cordelia Capodiferro Logan Marler | 2023/7/9 | |
Arrhenius Fatigue Life Modeling for Lead-Free Solder Joints in Accelerated Combined Fatigue and Creep Tests at Different Operating Temperatures | IEEE Transactions on Components, Packaging and Manufacturing Technology | Raed Al Athamneh Dania Bani Hani Mohammed Abueed | 2023/3/10 |
Predicting the Life of the Solder Joints in Electronic Assemblies using Physics-informed Data-driven Methodology | Qais Qasaimeh Jia Liu Awni Qasaimeh John Evans | 2023/5/30 | |
Effect of temperature on the low cycle fatigue properties of BGA solder joints | Microelectronics Reliability | Xin Wei Ali Alahmer Heneen Ali Sufyan Tahat Palash Pranav Vyas | 2023/7/1 |
An Integrated QFD and TRIZ Methodology for Innovative Product Design | Designs | Abdullah Al-Dwairi Omar Al-Araidah Sa’d Hamasha | 2023/11/16 |
Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model | Scientific Reports | Dania Bani Hani Raed Al Athamneh Mohammed Abueed Sa’d Hamasha | 2023/2/13 |
Effect of solder paste alloy and volume on solder voiding | Abdallah Alakayleh Mohamed El Amine Belhadi Sufyan Tahat Ehab HMasha Andrii Shmatok | 2023/5/30 | |
Effect of Bi content and aging on solder joint shear properties considering strain rate | Microelectronics Reliability | Mohamed El Amine Belhadi Ali Alahmer | 2023/7/1 |
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature | Microelectronics Reliability | Xin Wei Ali Alahmer Mohamed El Amine Belhadi Palash Pranav Vyas | 2023/10/1 |
Shear fatigue analysis of SAC-Bi solder joint exposed to varying stress cycling conditions | IEEE Transactions on Components, Packaging and Manufacturing Technology | Minghong Jian Ali Alahmer Xin Wei Mohamed El Amine Belhadi Abdallah Alakayleh | 2023/1/27 |
Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints | Scientific Reports | Dania Bani Hani Raed Al Athamneh Mohammed Abueed Sa’d Hamasha | 2023/5/26 |
Comparative Analysis of PEDOT and ITO under Thermal Bending and Cycling Stresses: Implications for Flexible Solar Cells | IEEE Transactions on Device and Materials Reliability | Mohammad M Hamasha Nasr Aldin Taamneh Khozima Hamasha Sahar Al Mashaqbeh Khalid Alzoubi | 2023/6/20 |
Assessing the SAC305 solder joint fatigue in ball grid array assembly using strain-controlled and stress-controlled approaches | Journal of Electronic Packaging | Xin Wei Sa'd Hamasha Ali Alahmer Mohamed El Amine Belhadi | 2023/9/1 |
Analysis and modeling of aged SAC-Bi solder joints subjected to varying stress cycling conditions | Materials | Minghong Jian Sa’d Hamasha Ali Alahmer Mohammad Hamasha Xin Wei | 2023/1/12 |
Author Correction: Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model | Scientific Reports | Dania Bani Hani Raed Al Athamneh Mohammed Abueed Sa’d Hamasha | 2023/5/9 |
Shear and fatigue properties of lead-free solder joints: Modeling and microstructure analysis | Journal of Electronic Packaging | Xin Wei Mohamed El Amine Belhadi Sa'd Hamasha Ali Alahmer Rong Zhao | 2023/6/1 |
