Premjeet Chahal

Premjeet Chahal

Michigan State University

H-index: 29

North America-United States

About Premjeet Chahal

Premjeet Chahal, With an exceptional h-index of 29 and a recent h-index of 22 (since 2020), a distinguished researcher at Michigan State University, specializes in the field of Terahertz, Semiconductors, Sensors, Packaging, Additive Manufacturing.

His recent articles reflect a diverse array of research interests and contributions to the field:

Material Mixing For Additive Manufacturing Apparatus

A Power-Efficient Compact Ku-Band System-on-Antenna Module with Chip-First Package Integration

Operation of Rigid-Flex 3-D Printed Microwave Antennas for UWB Radar Under Thermal and Vibration Stress Conditions

High Density Multi-Layer Millimeter-Wave Packaging and Interconnects Using Aerosol Jet Printing

RFID based Vehicular Positioning System for Safe Driving Under Adverse Weather Conditions

Additive Manufacturing of Millimeter Wave Passive Circuits on Thin Alumina Substrates

Patterned Multi-Material Die Attach Process Using Aerosol-Jet Printing

Flexible chip-first millimeter-wave packaging using multiple dielectrics

Premjeet Chahal Information

University

Position

Associate Professor

Citations(all)

3227

Citations(since 2020)

2091

Cited By

1881

hIndex(all)

29

hIndex(since 2020)

22

i10Index(all)

79

i10Index(since 2020)

57

Email

University Profile Page

Michigan State University

Google Scholar

View Google Scholar Profile

Premjeet Chahal Skills & Research Interests

Terahertz

Semiconductors

Sensors

Packaging

Additive Manufacturing

Top articles of Premjeet Chahal

Title

Journal

Author(s)

Publication Date

Material Mixing For Additive Manufacturing Apparatus

2024/2/1

A Power-Efficient Compact Ku-Band System-on-Antenna Module with Chip-First Package Integration

Xenofon Konstantinou

Nicholas Sturim

John D Albrecht

Premjeet Chahal

John Papapolymerou

2023/1/22

Operation of Rigid-Flex 3-D Printed Microwave Antennas for UWB Radar Under Thermal and Vibration Stress Conditions

F Rodriguez-Morales

V Occhiogrosso

B Scarbrough

E Arnold

V Gjokaj

...

2023/12/6

High Density Multi-Layer Millimeter-Wave Packaging and Interconnects Using Aerosol Jet Printing

Nicholas Sturim

Matt Hodek

Premjeet Chahal

John Albrecht

John Papapolymerou

2023/9/19

RFID based Vehicular Positioning System for Safe Driving Under Adverse Weather Conditions

Bhargav Avireni

Yihang Chu

Ethan Kepros

Mauro Ettorre

Premjeet Chahal

2023/5/30

Additive Manufacturing of Millimeter Wave Passive Circuits on Thin Alumina Substrates

Ethan Kepros

Yihang Chu

Bhargav Avireni

Brian Wright

Premjeet Chahal

2023/5/30

Patterned Multi-Material Die Attach Process Using Aerosol-Jet Printing

Wesley Spain

John Papapolymerou

Premjeet Chahal

John D Albrecht

2023/1/22

Flexible chip-first millimeter-wave packaging using multiple dielectrics

IEEE Transactions on Components, Packaging and Manufacturing Technology

Xenofon Konstantinou

John D Albrecht

Premjeet Chahal

John Papapolymerou

2022/3/17

Hybrid RFID based batteryless seat sensor with discontinuous RF transmission

IEEE Transactions on Vehicular Technology

Saikat Mondal

Yihang Chu

Mark Cuddihy

Ali Attaran

Mahmoud Yousef Ghannam

...

2022/1/25

Systems and methods for a multiband sensing platform

2022/7/12

3-D Printed W-band Substrate Integrated Waveguide Filter Using a Dam-and-Fill Process

Wesley Spain

Yihang Chu

Cameron Crump

Premjeet Chahal

2022/7/10

X-band Passive Circuits Using 3-D Printed Hollow Substrate Integrated Waveguides

Yihang Chu

Yamini Kotriwar

Ethan Kepros

Brian Wright

Premjeet Chahal

2022/5/31

A Broadband High-Efficiency Charge Pump for Ambient RF Energy Harvesting-Powering Underground RFID Based Sensors

Yihang Chu

Premjeet Chahal

2022/5/31

Additive Manufacturing for Rapid Prototyping of MM-Wave Circuits

Cameron Austin Crump

2021

Application of DNA sequences in anti-counterfeiting: Current progress and challenges

Saad Asadullah Sharief

Prem Chahal

Evangelyn Alocilja

2021/6/1

Multimaterial aerosol jet printed magnetic nanocomposites for microwave circuits

IEEE Transactions on Components, Packaging and Manufacturing Technology

Michael Thomas Craton

John D Albrecht

Premjeet Chahal

John Papapolymerou

2021/4/5

Manufactured interconnect packaging structure

2021/7/15

Millimeter Wave Imaging Array Using a Chip First Additive Manufacturing Process

Yihang Chu

Cameron Crump

Wesley Spain

Premjeet Chahal

2021/6/1

Wireless Sensing and Acquisition System for Non Destructive Evaluation and Structural Health Monitoring

Deepak Kumar

2021

Additive Manufacturing of a Wideband Capable W-Band Packaging Strategy

IEEE Microwave and Wireless Components Letters

Michael Thomas Craton

John D Albrecht

Premjeet Chahal

John Papapolymerou

2021/2/23

See List of Professors in Premjeet Chahal University(Michigan State University)

Co-Authors

H-index: 50
Timothy Hogan

Timothy Hogan

Michigan State University

H-index: 39
Edward Rothwell

Edward Rothwell

Michigan State University

H-index: 17
Deepak Kumar

Deepak Kumar

Michigan State University

H-index: 13
Amanpreet Kaur

Amanpreet Kaur

Oakland University

H-index: 13
Mohd Ifwat Mohd Ghazali

Mohd Ifwat Mohd Ghazali

Universiti Sains Islam Malaysia

H-index: 12
Saikat Mondal

Saikat Mondal

Michigan State University

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