Po-Chun Huang
National Tsing Hua University
H-index: 7
Asia-Taiwan
Top articles of Po-Chun Huang
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
A Novel Polymer-Based Ultra-High Density Bonding Interconnection | Yu-Min Lin Tsung-Yu Ou Yang Ou-Hsiang Lee Ching-Kuan Lee Hsiu-Kuei Ko | 2023/5/30 | |
Reliability of chip-last fan-out panel-level packaging for heterogeneous integration | John H Lau Cheng-Ta Ko Chia-Yu Peng Kai-Ming Yang Tim Xia | 2021/6/1 | |
Thermal cycling test and simulation of fan-out chip-last panel-level packaging for heterogeneous integration | Journal of Microelectronics and Electronic Packaging | John H Lau Cheng-Ta Ko Chia-Yu Peng Kai-Ming Yang Tim Xia | 2021/4/1 |
Chip-last (RDL-first) fan-out panel-level packaging (FOPLP) for heterogeneous integration | Journal of Microelectronics and Electronic Packaging | John H Lau Cheng-Ta Ko Chia-Yu Peng Kai-Ming Yang Tim Xia | 2020/7/1 |
Fan-Out RDL-first Panel-Level Packaging for Heterogeneous Integration | John H Lau Cheng-Ta Ko Kai-Ming Yang Chia-Yu Peng Tim Xia | 2020/6/3 | |
Panel-level fan-out RDL-first packaging for heterogeneous integration | IEEE Transactions on Components, Packaging and Manufacturing Technology | John H Lau Cheng-Ta Ko Kai-Ming Yang Chia-Yu Peng Tim Xia | 2020/5/25 |
