Ping-Chuan Wang

Ping-Chuan Wang

State University of New York at New Paltz

H-index: 30

North America-United States

About Ping-Chuan Wang

Ping-Chuan Wang, With an exceptional h-index of 30 and a recent h-index of 13 (since 2020), a distinguished researcher at State University of New York at New Paltz, specializes in the field of Materials Science, Microelectronics Reliability, Additive Manufacturing, Engineering Education.

His recent articles reflect a diverse array of research interests and contributions to the field:

Characterization of electromigration-induced short-range stress development in Al (0.25 at.% Cu) conductor line

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

Numerical Modeling of Electromigration in Al (0.25 at.% Cu) Interconnects

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

Robotics Mentorship as a Cross-Disciplinary Platform to Foster Engineering Soft Skills

Circuit-Level Microelectronics Reliability Project to Foster Interdisciplinary Engineering Learning

Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal

A Pilot Interdisciplinary Robotic Mentorship Project to Study Engineering Soft Skill Development

Ping-Chuan Wang Information

University

Position

___

Citations(all)

3373

Citations(since 2020)

899

Cited By

2910

hIndex(all)

30

hIndex(since 2020)

13

i10Index(all)

92

i10Index(since 2020)

26

Email

University Profile Page

State University of New York at New Paltz

Google Scholar

View Google Scholar Profile

Ping-Chuan Wang Skills & Research Interests

Materials Science

Microelectronics Reliability

Additive Manufacturing

Engineering Education

Top articles of Ping-Chuan Wang

Title

Journal

Author(s)

Publication Date

Characterization of electromigration-induced short-range stress development in Al (0.25 at.% Cu) conductor line

Journal of Applied Physics

P-C Wang

KT Cavanagh

JS Gordineer

NM Caprotti

2024/1/14

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

Journal of Electronic Packaging

Mahdi Farahikia

Ping-Chuan Wang

Louis Reyes

Matthew Krumholtz

2024/9/1

Numerical Modeling of Electromigration in Al (0.25 at.% Cu) Interconnects

James Gordineer

Ping-Chuan Wang

2024/2/7

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

Mahdi Farahikia

Ping-Chuan Wang

2023/10/24

Robotics Mentorship as a Cross-Disciplinary Platform to Foster Engineering Soft Skills

Ping-Chuan Wang

Wenyen Huang

Graham Werner

Darren Wang

James M Amodio

2023/6/25

Circuit-Level Microelectronics Reliability Project to Foster Interdisciplinary Engineering Learning

Nigel Michael Caprotti

Ping-Chuan Wang

2023/6/25

Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal

Zhuo-Jie George Wu

Ping-Chuan Wang

Seungman Choi

Patrick Justison

Martin Gall

...

2023/3/5

A Pilot Interdisciplinary Robotic Mentorship Project to Study Engineering Soft Skill Development

WenYen Huang

Ping-Chuan Wang

Seth Pearl

2021/11/12

Interdisciplinarity through microelectronics reliability course

Ping-Chuan Wang

2020/11/7

Electromigration monitor

2020/10/6

IC structure with interdigitated conductive elements between metal guard structures

2020/9/8

See List of Professors in Ping-Chuan Wang University(State University of New York at New Paltz)