Mohd Nizam Sudin
Universiti Teknikal Malaysia Melaka
H-index: 17
Asia-Malaysia
Top articles of Mohd Nizam Sudin
Title | Journal | Author(s) | Publication Date |
---|---|---|---|
A Note on Redesign Material Substitution and Topology Optimization in a Lightweight Robotic Gripper | Malaysian Journal of Applied Sciences | Mohd Nizam Sudin N Md Daud SA Shamsudin FR Ramli | 2023/4/30 |
The Effect of Nozzle Size on the Tensile and Flexural Properties of PLA Parts Fabricated Via FDM | Science, Engineering and Technology | Mohd Nizam Sudin Nazri Md Daud Faiz Redza Ramli Mohd Asri Yusuff | 2023/4/18 |
EFFECT OF PROCESS PARAMETERS ON VOID FORMATION IN FUSED DEPOSITION MODELLING (FDM) PART. | Suranaree Journal of Science & Technology | Mohd Nizam Sudin Nazri Md Daud Faiz Redza Ramli Mohd Asri Yusuff | 2023/3/1 |
A Brief Review of Factors Affecting the Mechanical Properties of Fused Deposition Modelling Part | MN Sudin SA Shamsuddin FR Ramli N Md Daud | 2022/12/12 | |
A COMPARISON OF THE FLEXURAL PROPERTIES OF PLA AND ABS PRINTED PARTS | Journal of Engineering and Technology (JET) | MN Sudin NM Daud MA Yusuff | 2022 |
The effect of tensile strength and surface roughness by varying oxygen level in 3D printer chamber | J. Tribol | M Arifuddin Che Mat F Redza Ramli M Nizam Sudin S Ghazali Herawan M Rizal Alkahari | 2022 |
CHARACTERISATION OF MECHANICAL-ELECTRICAL PROPERTIES OF GRAPHENE NANOPLATELETS FILLED EPOXY AS CONDUCTIVE INK. | Defence S&T Technical Bulletin | Maizura Mokhlis Mohd Azli Salim Nor Azmmi Masripan Adzni Md Saad Feng Dai | 2021/1/1 |
The Effects of Varying Oxygen Concentrations on Tensile Strength and Surface Roughness of 3D Printer | MA Che Mat FR Ramli MN Sudin SG Herawan MS Mat | 2021/11/23 | |
Influence of process parameters in wire and arc additive manufacturing (WAAM) process | Journal of Mechanical Engineering (JMechE) | Nor Ana Rosli Mohd Rizal Alkahari Faiz Redza Ramli Mohd Nizam Sudin Shajahan Maidin | 2021/9/7 |
Test Load Determination on Composite Standard Malaysian Rubber Constant Viscosity 60 for Earthquake Isolator | International Journal of Nanoelectronics and Materials | Mohd Azli Salim Intan Raihan Asni Rosszainily Adzni Md Saad Mohd Nizam Sudin Andrey N Dmitriev | 2020/5/2 |
DIMENSIONAL ACCURACY OF FUSED FILAMENT FABRICATION BY CASSAVA ADHESION ON PRINTING PLATFORM | Journal of Advanced Manufacturing Technology (JAMT) | FR Ramli MA Nazan MR Alkahari MA Abdullah MN Sudin | 2020/12/22 |
Driving monitoring system application with stretchable conductive inks: A review | Ameeruz Kamal Ab Wahid Mohd Azli Salim Nor Azmmi Masripan Adzni Md Saad Dan Dobrota | 2020/5/2 | |
Design of a shape-changing linkage mechanism in an aircraft wing | Proceedings of Mechanical Engineering Research Day | Adinda Hadirah Mohd Zin Shamsul Anuar Shamsudin Shafizal Mat Mohd Nizam Sudin Faiz Redza Ramli | 2020/12 |
Resistivity Characterization for Carbon Based Conductive Nanocomposite on Polyethylene Terephthalate and Thermoplastic Polyurethane Substrates. | INTERNATIONAL JOURNAL OF NANOELECTRONICS AND MATERIALS | Norhisham Ismail Mohd Azli Salim Azmi Naroh Nor Azmmi Masripan Adzni Md Saad | 2020/5/2 |
Influence of layer thickness and infill design on the surface roughness of PLA, PETG and metal copper materials | Proc. Mech. Eng. Res. Day | MC Mat Faiz Redza Ramli Mohd Rizal Alkahari Mohd Nizam Sudin MF Abdollah | 2020/12 |
INVESTIGATION OF THE MECHANICAL PROPERTIES OF STANDARD MALAYSIAN RUBBER WITH CONSTANT VISCOSITY AND EPOXIDISED NATURAL RUBBER USING NANO-INDENTATION TEST. | Defence S&T Technical Bulletin | Mohd Azli Salim Adzni Md Saad Azmi Naroh Mohd Nizam Sudin Crtomir Donik | 2020/1/1 |
Development of Planar, Shape-changing Rigid Body Segmentation Process for General Design Profiles | Journal of Mechanical Engineering and Technology (JMET) | Shamsul Anuar Shamsudin Zairulazha Zainal Mohd Nizam Sudin Huthaifa Ahmed Al-Issa | 2020/6/29 |
SCIENCE & TECHNOLOGY RESEARCH INSTITUTE FOR DEFENCE (STRIDE) | Mahdi Che Isa Abdul Rauf Abdul Manaf Mohd Hambali Anuar Ahmad Fuad Ab Ghani Jamaluddin Mahmud | 2021 | |
Nanoindentation of Graphene Reinforced Epoxy Resin as a Conductive Ink for Microelectronic Packaging Application. | International Journal of Nanoelectronics & Materials | Maizura Mokhlis Mohd Azli Salim Nor Azmmi Masripan Adzni Md Saad Mohd Nizam Sudin | 2020/5/2 |