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Martin K. Anselm

Martin K. Anselm

Rochester Institute of Technology

H-index: 10

North America-United States

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About Martin K. Anselm

Martin K. Anselm, With an exceptional h-index of 10 and a recent h-index of 7 (since 2020), a distinguished researcher at Rochester Institute of Technology, specializes in the field of Solder Reliability and Microstructure.

His recent articles reflect a diverse array of research interests and contributions to the field:

Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process

The effect of peak reflow temperature on thermal cycling performance and failure mode of hybrid low temperature solder joints

Martin K. Anselm Information

University

Position

___

Citations(all)

327

Citations(since 2020)

155

Cited By

253

hIndex(all)

10

hIndex(since 2020)

7

i10Index(all)

12

i10Index(since 2020)

4

Email

University Profile Page

Google Scholar

Martin K. Anselm Skills & Research Interests

Solder Reliability and Microstructure

Top articles of Martin K. Anselm

Title

Journal

Author(s)

Publication Date

Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process

Journal of Surface Mount Technology

Tayler J Swanson

Martin K Anselm

2023/10/26

The effect of peak reflow temperature on thermal cycling performance and failure mode of hybrid low temperature solder joints

Richard Coyle

Martin Anselm

Faramarz Hadian

Sahana Kempaiah

Anto Raj

...

2021

See List of Professors in Martin K. Anselm University(Rochester Institute of Technology)