Lei Liu

Lei Liu

Tsinghua University

H-index: 39

Asia-China

About Lei Liu

Lei Liu, With an exceptional h-index of 39 and a recent h-index of 30 (since 2020), a distinguished researcher at Tsinghua University, specializes in the field of Ultrafast laser manufacturing, Microjoining, Nanojoining, Welding.

His recent articles reflect a diverse array of research interests and contributions to the field:

Highly accurate and efficient prediction of effective thermal conductivity of sintered silver based on deep learning method

Predicting Effective Thermal Conductivity of Sintered Silver by Microstructural-Simulation-Based Machine Learning

High performance 1D–2D CuO/MoS 2 photodetectors enhanced by femtosecond laser-induced contact engineering

The mechanism of irregular hole-shape formation during ultrafast laser micro-drilling of metals

纳米颗粒材料作中间层的烧结连接及其封装应用研究进展

Rapid and low temperature sintering bonding using Cu nanoparticle film for power electronic packaging

Atomic bonding-engineered heterogeneous integration of semiconductor nanowires by femtosecond laser irradiation for a miniaturized photodetector

先进封装中铜-铜低温键合技术研究进展

Lei Liu Information

University

Position

Associate Professor Dept. of Mechanical Engineering

Citations(all)

4615

Citations(since 2020)

3453

Cited By

2215

hIndex(all)

39

hIndex(since 2020)

30

i10Index(all)

113

i10Index(since 2020)

97

Email

University Profile Page

Tsinghua University

Google Scholar

View Google Scholar Profile

Lei Liu Skills & Research Interests

Ultrafast laser manufacturing

Microjoining

Nanojoining

Welding

Top articles of Lei Liu

Title

Journal

Author(s)

Publication Date

Highly accurate and efficient prediction of effective thermal conductivity of sintered silver based on deep learning method

International Journal of Heat and Mass Transfer

Chengjie Du

Guisheng Zou

A Zhanwen

Bingzhou Lu

Bin Feng

...

2023/2/1

Predicting Effective Thermal Conductivity of Sintered Silver by Microstructural-Simulation-Based Machine Learning

Journal of Electronic Materials

Chengjie Du

Guisheng Zou

Bin Feng

Jinpeng Huo

Yu Xiao

...

2023/1/19

High performance 1D–2D CuO/MoS 2 photodetectors enhanced by femtosecond laser-induced contact engineering

Materials Horizons

Jinpeng Huo

Guisheng Zou

Yu Xiao

Tianming Sun

Bin Feng

...

2023

The mechanism of irregular hole-shape formation during ultrafast laser micro-drilling of metals

Applied Physics A

Guisheng Zou

Wenzheng Zhao

Bin Feng

Chengjie Du

Yuxi Wu

...

2023/2

纳米颗粒材料作中间层的烧结连接及其封装应用研究进展

贾强, 邹贵生, 张宏强, 王文淦, 邓钟炀, 任辉, 刘磊, 彭鹏, 郭伟

2022/3/19

Rapid and low temperature sintering bonding using Cu nanoparticle film for power electronic packaging

Applied Surface Science

Yongchao Wu

Guisheng Zou

Shuaiqi Wang

Wei Guo

Hongqiang Zhang

...

2022/11/30

Atomic bonding-engineered heterogeneous integration of semiconductor nanowires by femtosecond laser irradiation for a miniaturized photodetector

Applied Surface Science

Tianming Sun

Jinpeng Huo

Yu Xiao

Lei Liu

Bin Feng

...

2022/2/1

先进封装中铜-铜低温键合技术研究进展

王帅奇, 邹贵生, 刘磊

2022/11/25

微米银焊点的超快激光图形化沉积及其在芯片连接中的应用探索

Chinese Journal of Lasers

吴永超, 胡锦涛, 郭伟, 刘磊, 康慧, 彭鹏

2022/1/1

Temporal and spatial heat input regulation strategy for high-throughput micro-drilling based on multi-beam ultrafast laser

Optics & Laser Technology

A Zhanwen

Guisheng Zou

Yuxi Wu

Ying Wu

Bin Feng

...

2022/11/1

Research progress on solder thermal interface materials

江阳, 邹贵生, 杜成杰, 刘磊

2022/8/13

Locally Thinned, Core–Shell Nanowire-Integrated Multi-gate MoS2 Transistors for Active Control of Extendable Logic

ACS Applied Materials & Interfaces

Yu Xiao

Guisheng Zou

Jinpeng Huo

Tianming Sun

Bin Feng

...

2022/12/22

Boride evolutionary behavior and mechanism in the TLP repaired IN738 superalloy with crack-like defects

Journal of Alloys and Compounds

Hongqiang Zhang

Junliang Xue

Yu Ye

Hailin Bai

Wei Guo

...

2022/7/15

Venation‐Mimicking, Ultra‐Stretchable, Room Temperature‐Attachable Metal Tapes for Integrated Electronic Skins

Advanced Materials

Bin Feng

Tianming Sun

Wengan Wang

Yu Xiao

Jinpeng Huo

...

2022/12/9

Effect of Ag Sintered Bondline Thickness on High-Temperature Reliability of SiC Power Devices

IEEE Transactions on Components, Packaging and Manufacturing Technology

Zhongyang Deng

Guisheng Zou

Qiang Jia

Bin Feng

Hongqiang Zhang

...

2021/9/7

Solar anti-icing surface with enhanced condensate self-removing at extreme environmental conditions

Proceedings of the National Academy of Sciences

Hongqiang Zhang

Guanlei Zhao

Shuwang Wu

Yousif Alsaid

Wenzheng Zhao

...

2021/5/4

Sintering mechanism of Ag-Pd nanoalloy film for power electronic packaging

Applied Surface Science

Qiang Jia

Guisheng Zou

Hongqiang Zhang

Wengan Wang

Hui Ren

...

2021/7/15

超快激光纳米线连接技术研究进展 Invited

林路禅, 邢松龄, 霍金鹏, 肖宇, 彭鹏, 沈道智, 刘磊, 邹贵生

2021/4/13

Diamond thin films integrated with flexible substrates and their physical, chemical and biological characteristics

Journal of Physics D: Applied Physics

Yang Xie

Huachun Wang

Dali Cheng

He Ding

Deying Kong

...

2021/7/9

Femtosecond Laser Irradiation-Mediated MoS₂–Metal Contact Engineering for High-Performance Field-Effect Transistors and Photodetectors

Jinpeng Huo

Yu Xiao

Tianming Sun

Guisheng Zou

Daozhi Shen

...

2021

See List of Professors in Lei Liu University(Tsinghua University)