Kuan-Neng Chen
National Chiao Tung University
H-index: 41
Asia-Taiwan
Top articles of Kuan-Neng Chen
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Advancements in single-crystal silicon with elevated-laser-liquid-phase-epitaxy (ELLPE) for monolithic 3D ICs | Japanese Journal of Applied Physics | Bo-Jheng Shih Yu-Ming Pan Hao-Tung Chung Nein-Chih Lin Chih-Chao Yang | 2024/4/2 |
Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications | IEEE Journal of the Electron Devices Society | Yuan-Chiu Huang Han-Wen Hu Yun-Hsi Liu Hui-Ching Hsieh Kuan-Neng Chen | 2024/1/26 |
Semiconductor device and method of manufacturing the same | 2023/4/18 | ||
A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications | IEEE Electron Device Letters | Yuan-Chiu Huang Yu-Xian Lin Chien-Kang Hsiung Yu-Tao Yang Tzu-Heng Hung | 2024/1/10 |
A Review on Hybrid Bonding Interconnection and Its Characterization | Chien-Kang Hsiung Kuan-Neng Chen | 2024/4/17 | |
Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration | Applied Surface Science | Zhong-Jie Hong Demin Liu Han-Wen Hu Chien-Kang Hsiung Chih-I Cho | 2023/2/1 |
Stress issue of vertical connections in 3D integration for high-bandwidth memory applications | Memories-Materials, Devices, Circuits and Systems | Tzu-Heng Hung Yu-Ming Pan Kuan-Neng Chen | 2023/7/1 |
Antenna package structure | 2023/12/14 | ||
Scheme for Multi-Chiplet Integration With Low Thermal Budget by Asymmetric Cu-Cu Bonding With Au Passivation Bonding Structure | IEEE Electron Device Letters | Zhong-Jie Hong Ming-Wei Weng Chih-Han Chen Mu-Ping Hsu Han-Wen Hu | 2023/1/23 |
TSV Integration with Chip Level TSV-to-Pad Cu/SiO2 Hybrid Bonding for DRAM Multiple Layer Stacking | IEEE Electron Device Letters | Tzu-Heng Hung James Yi-Jen Lo Tzu-Ying Kuo Shing-Yih Shih Sheng-Fu Huang | 2023/5/25 |
Development of low-temperature bonding platform using ultra-thin area selective deposition for heterogeneous integration | Applied Surface Science | Mu-Ping Hsu Chi-Yu Chen Hsin-Chi Chang Zhong-Jie Hong Ming-Wei Weng | 2023/10/30 |
Single-Crystal Germanium by Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique for Monolithic 3D ICs | IEEE Electron Device Letters | Hao-Tung Chung Yu-Ming Pan Nein-Chih Lin Bo-Jheng Shih Chih-Chao Yang | 2023/5/11 |
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application | Yuan-Chiu Huang Yu-Xian Lin Chien-Kang Hsiung Tzu-Heng Hung Kuan-Neng Chen | 2023/9/4 | |
High-Performance P-type Germanium Tri-gate FETs via Green Nanosecond Laser Crystallization and Counter Doping for Monolithic 3D ICs | IEEE Journal of the Electron Devices Society | Hao-Tung Chung Yu-Ming Pan Nein-Chih Lin Bo-Jheng Shih Chih-Chao Yang | 2023/4/26 |
A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N | IEEE Journal of the Electron Devices Society | Tzu-Heng Hung Ping-Jung Liu Chiao-Yen Wang Tsai-Fu Chung Kuan-Neng Chen | 2023/8/24 |
Bonding element and method for manufacturing the same | 2023/4/4 | ||
Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Pre-Bond for Cu/Polymer Hybrid Bonding | IEEE Transactions on Components, Packaging and Manufacturing Technology | Chia-Hsin Lee Chung-An Tan Michelle Fowler Ting-Yu Ko Yu-Min Lin | 2023/8/2 |
Three dimensional integrated circuit and fabrication thereof | 2023/11/23 | ||
A hybrid bonding interconnection with a novel low-temperature bonding polymer system | Yu-Min Lin Po-Chih Chang Ou-Hsiang Lee Wei-Lan Chiu Tao-Chih Chang | 2022/5/31 | |
Investigation of bonding mechanism for low-temperature CuCu bonding with passivation layer | Applied Surface Science | Zhong-Jie Hong Demin Liu Han-Wen Hu Chih-I Cho Ming-Wei Weng | 2022/8/1 |
