Jang Min Park
Yeungnam University
H-index: 17
Asia-South Korea
Top articles of Jang Min Park
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Plane-symmetric co-flow capillary for the generation of monodisperse droplets | Microfluidics and Nanofluidics | Yao Gong Lili Zou Jang Min Park Kai You Xiang Yi | 2024/2 |
Diverging radial flow of a viscoplastic fluid in narrow gaps of varying thickness | Journal of Non-Newtonian Fluid Mechanics | Jang Min Park Kukhee Lim | 2023/6/1 |
Numerical study on the engulfing behavior between immiscible droplets in a confined shear flow | Chemical Engineering Science | Wankun Liu Jang Min Park | 2023/2/2 |
Effect of entry geometry on droplet dynamics in contraction microchannel | International Journal of Multiphase Flow | Van Thanh Hoang Van Duong Le Jang Min Park Bich-Tram Truong-Le | 2023/6/10 |
Ternary modeling of the interaction between immiscible droplets in a confined shear flow | Physical Review Fluids | Wankun Liu Jang Min Park | 2022/1/25 |
Multi-dimensional finite element analyses of OECD lower head failure tests | Nuclear Engineering and Technology | Jang Min Park Kukhee Lim | 2022/12/1 |
Computational Study on the Clamping Mechanism in the Injection Molding Machine | The International Journal of Advanced Manufacturing Technology | Van-Duong Le Van-Thanh Hoang Tao Quang Bang Lahouari Benabou Ngoc-Hai Tran | 2022/8 |
The One/Multi-objective Optimization for Tensile Yield and Impact Strength Responses of Optical PC/PMMA Blends | International Journal of Precision Engineering and Manufacturing | Minh-Sang Tran Van-Thanh Hoang Jang-Min Park | 2022/3/4 |
Discussion on “Analysis of Bingham fluid radial flow in smooth fractures”[J Rock Mech Geotech Eng 12 (2020) 1112–1118] | Journal of Rock Mechanics and Geotechnical Engineering | Van Thanh Hoang Wankun Liu Jang Min Park | 2021/8 |
Flow classification of radial and squeeze flows between parallel disks | Journal of Non-Newtonian Fluid Mechanics | Jang Min Park | 2020/12/1 |
Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application | The International Journal of Advanced Manufacturing Technology | Yao Gong Kyoung Je Cha Jang Min Park | 2020/5 |
Co-Authors
