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Indranath Dutta

Indranath Dutta

Washington State University

H-index: 34

North America-United States

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About Indranath Dutta

Indranath Dutta, With an exceptional h-index of 34 and a recent h-index of 15 (since 2020), a distinguished researcher at Washington State University, specializes in the field of Interfaces, Solders, Microelectronics, Flexible Interconnects, Manufacturing.

His recent articles reflect a diverse array of research interests and contributions to the field:

Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration

Stereological Analysis of Microstructural Evolution Due to Aging in SnAgCu Solder Alloys

Materials and Processing of TSV

Microstructure and mechanical reliability issues of TSV

Mitigation of whisker growth in tin coatings by alloying with indium

A cutting mechanism map for machining metallic sheets using electric current pulses

A model for intermetallic growth in thin Sn joints between Cu substrates: application to solder microjoints

A technique for machining thin metallic foils using electromagnetic-mechanical pulsed loading

Indranath Dutta Information

University

Position

___

Citations(all)

4331

Citations(since 2020)

908

Cited By

3853

hIndex(all)

34

hIndex(since 2020)

15

i10Index(all)

90

i10Index(since 2020)

29

Email

University Profile Page

Google Scholar

Indranath Dutta Skills & Research Interests

Interfaces

Solders

Microelectronics

Flexible Interconnects

Manufacturing

Top articles of Indranath Dutta

Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration

Journal of Electronic Materials

2024/3

Indranath Dutta
Indranath Dutta

H-Index: 18

Stereological Analysis of Microstructural Evolution Due to Aging in SnAgCu Solder Alloys

Journal of Electronic Materials

2024/1/10

Materials and Processing of TSV

3D Microelectronic Packaging: From Architectures to Applications

2021

Praveen Kumar
Praveen Kumar

H-Index: 4

Indranath Dutta
Indranath Dutta

H-Index: 18

Zhiheng Huang
Zhiheng Huang

H-Index: 4

Paul Conway
Paul Conway

H-Index: 11

Microstructure and mechanical reliability issues of TSV

2021

Praveen Kumar
Praveen Kumar

H-Index: 4

Indranath Dutta
Indranath Dutta

H-Index: 18

Zhiheng Huang
Zhiheng Huang

H-Index: 4

Paul Conway
Paul Conway

H-Index: 11

Mitigation of whisker growth in tin coatings by alloying with indium

2020/12/29

A cutting mechanism map for machining metallic sheets using electric current pulses

Engineering Research Express

2020/6/8

Praveen Kumar
Praveen Kumar

H-Index: 4

Indranath Dutta
Indranath Dutta

H-Index: 18

A model for intermetallic growth in thin Sn joints between Cu substrates: application to solder microjoints

Journal of Electronic Materials

2020/5

A technique for machining thin metallic foils using electromagnetic-mechanical pulsed loading

Engineering Research Express

2020/2/5

Deepak Sharma
Deepak Sharma

H-Index: 1

Indranath Dutta
Indranath Dutta

H-Index: 18

Praveen Kumar
Praveen Kumar

H-Index: 4

Recent advances in mitigation of whiskers from electroplated tin

2020/2

See List of Professors in Indranath Dutta University(Washington State University)