George Flowers
Auburn University
H-index: 30
North America-United States
Top articles of George Flowers
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Investigation on Impedance Optimization for the BGA-Bonding Wire Transition Structure | IEEE Transactions on Components, Packaging and Manufacturing Technology | Kaixuan Song Jinchun Gao George T Flowers Ziren Wang Chaoyi Wang | 2023/11/23 |
breaker technology, arcing phenomena, arc fault detection, and arc flash mitigation. He will | George Flowers | 2023/10/4 | |
Novel phononic-crystal-arrayed acoustic metalens for long beam focusing in multi-band | Applied Physics Express | Fuxi Zhang Wei Tao Shiming Wang Qingsong Hu George T Flowers | 2023/7/24 |
Investigation of signal integrity of fuzz button connectors under different compression states | Microwave and Optical Technology Letters | Wenjia Wang Jinchun Gao George T Flowers Ziren Wang Lingyu Bi | 2023/7 |
Meta-structure hull design with periodic layered phononic crystals theory for wide-band low-frequency sound insolation | Materials | Fuxi Zhang Xinyi Sun Wei Tao Shiming Wang George T Flowers | 2023/6/16 |
Impact of Multiple Insertions and Withdrawals, and Vibration on Passive Intermodulation in Coaxial Connectors | IEEE Transactions on Microwave Theory and Techniques | Lingyu Bi Jinchun Gao George T Flowers Ziren Wang Junyu Luo | 2022/9/5 |
Investigation on vibration induced fretting in degraded contact interface | Microelectronics Reliability | Qingya Li Jinchun Gao George T Flowers Wei Yi Robert L Jackson | 2022/12/1 |
Modeling of the Signal Transmission of a Coaxial Connector With a Degraded Dielectric Layer in a Humid Environment | IEEE Transactions on Dielectrics and Electrical Insulation | Wenjia Wang Jinchun Gao George T Flowers Ziren Wang Lingyu Bi | 2022/7/4 |
The Impact of the Connection Failure of Ground Solder Balls on Digital Signal Waveform | IEEE Transactions on Electromagnetic Compatibility | Kaixuan Song Jinchun Gao George T Flowers Ziren Wang Chaoyi Wang | 2022/11/30 |
Investigation of impedance compensation in radio frequency circuits with bonding wire | International Journal of RF and Microwave Computer‐Aided Engineering | Ziren Wang Jinchun Gao George T Flowers Kaixuan Song Wei Yi | 2022/6 |
Modeling and Analysis of Electrical-Thermal Performance of the Contact Surface of Coaxial Connectors at High Frequency and High Power | Yuqi Zhou Jinchun Gao George T Flowers | 2022/10/23 | |
Effect of impedance discontinuity induced by line bending on passive intermodulation in connector-microstrip assemblies | IEEE Microwave and Wireless Components Letters | Qiuyan Jin Quanyuan Feng George T Flowers Lingyu Bi Junyu Luo | 2022/4/28 |
Effects of Mechanical Design on Passive Intermodulation in Coaxial Connectors | Junyu Luo George T Flowers Jinchun Gao Lingyu Bi | 2022/10/23 | |
Modeling and analysis of signal integrity of ball grid array packages with failed ground solder balls | IEEE Transactions on Components, Packaging and Manufacturing Technology | Kaixuan Song Jinchun Gao George T Flowers Ziren Wang Wei Yi | 2022/1/14 |
Welcome to the 67th IEEE Holm Conference on Electrical Contacts. It is wonderful that we are able to have this conference on-site in beautiful Tampa, Florida this year. We all … | George Flowers | 2022/10/23 | |
Effects of Interrupting the Contiguous Sn Thin-Film Network in Whiskering | IEEE Transactions on Components, Packaging and Manufacturing Technology | Zekun Wang MJ Bozack GT Flowers Fuxi Zhang | 2021/12/7 |
Intelligent Detection Methods of Electrical Connection Faults in RF Circuits | Applied Sciences | Ziren Wang Jiaqi Li George T Flowers Jinchun Gao Kaixuan Song | 2021/10/25 |
Impact of Signal Frequency on Passive Intermodulation in Coaxial Connectors | Lingyu Bi George T Flowers Jinchun Gao Junyu Luo Wenjia Wang | 2021/10/24 | |
Impact of physical dimensions and dielectric materials in fuzz button interconnection area on signal transmission | Wenjia Wang Jinchun Gao George T Flowers Ziren Wang Junyu Luo | 2021/10/24 | |
Microfibrous mesh and polymer damping of micromachined vibration isolators | IEEE Transactions on Components, Packaging and Manufacturing Technology | Brent Bottenfield Arthur Gernt Bond Brian A English George T Flowers Robert N Dean | 2021/3/4 |
Co-Authors
