Bo Tian

Bo Tian

University of South Carolina

H-index: 7

North America-United States

About Bo Tian

Bo Tian, With an exceptional h-index of 7 and a recent h-index of 7 (since 2020), a distinguished researcher at University of South Carolina, specializes in the field of Power device and module Design Fabrication Thermal management Condition monitoring.

His recent articles reflect a diverse array of research interests and contributions to the field:

Thermal Management for Ship Electrification-Approaches for Power Electronic Building Blocks and Power Corridors

Power electronic modules

Scalable two-phase cooling plates

Thermal Management Approaches for Power Electronic Building Blocks and Power Corridors

High-Performance Wide Bandgap Semiconductor Power Modules Enabled by Advanced Two-Phase Mini-Channel Cooling

Two-Phase Milli/Microchannel Cooling for SiC Power Module using Dielectric Fluid Coolant

Bo Tian Information

University

University of South Carolina

Position

___

Citations(all)

359

Citations(since 2020)

232

Cited By

220

hIndex(all)

7

hIndex(since 2020)

7

i10Index(all)

7

i10Index(since 2020)

7

Email

University Profile Page

University of South Carolina

Bo Tian Skills & Research Interests

Power device and module Design Fabrication Thermal management Condition monitoring

Top articles of Bo Tian

Thermal Management for Ship Electrification-Approaches for Power Electronic Building Blocks and Power Corridors

Authors

JC Ordonez,C Sailabada,J Chalfant,C Chryssostomidis,C Li,K Luo,E Santi,B Tian,A Biglo,N Rajagopal,J Stewart,C DiMarino

Journal

IEEE Transactions on Transportation Electrification

Published Date

2024/4/18

This paper presents an overview of thermal management solutions, in support of ship electrification, that are being investigated for power electronic building blocks and their integration into power corridors, both of which are seen as enablers of flexible and reconfigurable power distribution systems in the next generation Navy ships. Air, liquid, two-phase, and indirect cooling approaches are discussed in the context of specific building block configurations built and designed at CPES (Virginia Tech). The paper presents an overview of ongoing efforts towards the design, construction, and testing of cooling technology prototypes.

Power electronic modules

Authors

Enrico Santi,Bo Tian,Kang Peng

Published Date

2024/1/1

A power electronic module is an assembly containing several power components, mostly power semiconductor devices, properly internally interconnected to perform a power conversion function. It is an integrated building block for the realization of a power converter with a reduced number of external components required. Advantages of power modules are tight integration of multiple power semiconductor devices, high current and power ratings and reduction of parasitic elements. The article discusses the manufacturing process of power modules, thermal management, reliability, and provides design guidelines and considerations for the use of power modules to realize a power converter.

Scalable two-phase cooling plates

Published Date

2023/12/14

In the past, several microchannel configurations were developed to realize two-phase cooling for high-power electronics, but these were limited to small devices with sizes at cm length. It has been a challenge to implement effective two-phase cooling to large devices with a length of 10 cm due to notorious scaling effects. Here, we devised a novel channel configuration to achieve effective two-phase cooling on devices with an area of 10 cm by 5 cm or larger, which is the prevailing size of major commercial electronics and power electronics devices. In a lab environment, we demonstrated that the novel channel configuration can meet their cooling needs.

Thermal Management Approaches for Power Electronic Building Blocks and Power Corridors

Authors

JC Ordonez,C Sailabada,J Chalfant,C Chryssostomidis,C Li,K Luo,E Santi,B Tian,A Biglo,N Rajagopal,J Stewart,C DiMarino

Published Date

2023/8/1

This paper presents an overview of thermal management solutions that are being investigated for power electronic building blocks and their integration into power corridors, both of which are seen as enablers of flexible and reconfigurable power distribution systems in the next generation Navy ships. Air, liquid, two-phase, and indirect cooling approaches are discussed in the context of specific building block configurations built and designed at CPES (Virginia Tech). The paper concludes with an overview of ongoing efforts towards the design, construction, and testing of technology prototypes.

High-Performance Wide Bandgap Semiconductor Power Modules Enabled by Advanced Two-Phase Mini-Channel Cooling

Authors

Bo Tian

Published Date

2022

There is a widespread need for high performance wide bandgap power modules in both commercial and military applications. However, given the rapid advancements of wide bandgap power module technology, conventional cooling solutions have not kept up and do not provide the thermal management performance needed for high power density. Based on the two-phase cooling approach, two-phase microchannels operating at low fluid flow rates with low pressure drops have huge potential in enabling higher power density applications. Several studies have illustrated the potential great advantages of two-phase cooling compared to single-phase cooling in terms of maximum device temperature, spatial thermal distribution and required pumping power, but no experimental validation for a power module application has been presented.

Two-Phase Milli/Microchannel Cooling for SiC Power Module using Dielectric Fluid Coolant

Authors

Bo Tian,Wei Chang,Enrico Santi,Chen Li,Tianyu Zhang,Lang Yuan

Published Date

2021/8/3

This paper proposes a novel approach for thermal management of a SiC power module using a two-phase mili/microchannel coldplate utilizing a dielectric fluid coolant. Simulation results show the superior thermal performance of two-phase mili/microchannel compared to a conventional single-phase coldplate, with a 36% reduction in chip temperature rise and up to 400 times better reliability. The experimental validation is done by comparison of two-phase cooling and single-phase cooling performance. The test results show that up to 81% improvement in junction temperature rise and 2.41 times reduction of thermal resistance of coldplate are achieved, which demonstrates the advantages of two-phase mili/microchannel cooling.

See List of Professors in Bo Tian University(University of South Carolina)

Bo Tian FAQs

What is Bo Tian's h-index at University of South Carolina?

The h-index of Bo Tian has been 7 since 2020 and 7 in total.

What are Bo Tian's top articles?

The articles with the titles of

Thermal Management for Ship Electrification-Approaches for Power Electronic Building Blocks and Power Corridors

Power electronic modules

Scalable two-phase cooling plates

Thermal Management Approaches for Power Electronic Building Blocks and Power Corridors

High-Performance Wide Bandgap Semiconductor Power Modules Enabled by Advanced Two-Phase Mini-Channel Cooling

Two-Phase Milli/Microchannel Cooling for SiC Power Module using Dielectric Fluid Coolant

are the top articles of Bo Tian at University of South Carolina.

What are Bo Tian's research interests?

The research interests of Bo Tian are: Power device and module Design Fabrication Thermal management Condition monitoring

What is Bo Tian's total number of citations?

Bo Tian has 359 citations in total.

What are the co-authors of Bo Tian?

The co-authors of Bo Tian are Wei Qiao.

    Co-Authors

    H-index: 68
    Wei Qiao

    Wei Qiao

    University of Nebraska-Lincoln

    academic-engine

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