Avenas Yvan
Grenoble INP
H-index: 25
Europe-France
Top articles of Avenas Yvan
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Test bench for the characterization of two-phase passive immersion cooling of power electronic devices | Clément Hugon Yvan Avenas Samuel Siedel Sébastien Flury | 2024/3/12 | |
Flip-Chip Low inductive and EMC optimized PCB Power Module | Fatme Abed Ali Pierre-Olivier Jeannin Yvan Avenas Pierre Lefranc | 2024/2/25 | |
Field Plate Integration for Mitigating Partial Discharge Activity in PCB-Embedded Power Electronic Modules | Energies | Paul Bruyere Eric Vagnon Yvan Avenas | 2024/4/25 |
Interest of high frequency decoupling inductors for reducing common mode current in high speed switching cells | N Botter WF Bikinga Y Avenas JM Guichon JL Schanen | 2024/3/12 | |
Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly | Moisés Ferber Paul Bruyère Nicolas Botter Alejandro Can Souhila Bouzerd | 2024/3/12 | |
Metal-Air-FR4 Electrical Field Management with Embedded Electrical Field Plates for PCB Embedded Power Electronics | Paul Bruyere Eric Vagnon Yvan Avenas Mohamed El Khattabi | 2024/3/12 | |
Impact of the Printed Circuit Board Geometrical Design on the AC Breakdown and Partial Discharge Activity in Air | Paul Bruyere Eric Vagnon Yvan Avenas | 2023/10/15 | |
Design of Power Modules Using Containers Filled With Phase Change Materials as Device Top Interconnection for Power Peak Management | Rabih Khazaka Yvan Avenas Rachelle Hanna Stephane Azzopardi | 2023/4/16 | |
Effect of Large Amplitude Thermal Cycles on Power Assemblies Based on Ceramic Heat Sink and Multilayer Pressureless Silver Sintering | IEEE Transactions on Device and Materials Reliability | Nicolas Botter Rabih Khazaka Yvan Avenas Jean-Michel Missiaen Didier Bouvard | 2023/2/20 |
Porous Copper Layer Development by Dynamic Hydrogen Bubble Template for Power Modules Assembling by Thermocompression | Electrochemical Society Meeting Abstracts 243 | Jonathan Schoenleber Lucas Chachay Goulven Janod Marie-Pierre Gigandet Jean-Yves Hihn | 2023/8/28 |
Thermocompression de cuivre poreux réalisée par dépôt électrochimique pour l’assemblage des composants semi conducteurs de puissance | Goulven Janod Yvan Avenas Lucas Chachay Jean-Michel Missiaen Rémi Daudin | 2023/7/5 | |
Thermal Efficiency Evaluation after Thermocompression of Copper Layer Obtained By Dynamic Hydrogen Bubble | Electrochemical Society Meeting Abstracts 244 | Jonathan Schoenleber Goulven Janod Lucas Chachay Marie-Pierre Gigandet Yvan Avenas | 2023/12/22 |
Thermal Evaluation of Substrate Technologies Used for Power Peak Management in SSPC Modules | Rabih Khazaka Guy Scoggin Yvan Avenas Toni Youssef Cyrille Gautier | 2023/5/9 | |
Power electronics system | 2023/12/21 | ||
Towards a Modular Multilevel Flying Capacitor Module using SiC MOSFETs | Omar Sanjakdar Luis Gabriel Alves Rodrigues Yvan Avenas | 2023/5/9 | |
2023 Index IEEE Transactions on Device and Materials Reliability Vol. 23 | IEEE Transactions on Device and Materials Reliability | A Amin T An S Ananiev YE Aras G Arutchelvan | 2023/12 |
Design of an Integrated Power Module for Silicon Carbide MOSFET with Self-Compensation of the Magnetic Field | Materials Science Forum | Fatme Abed Ali Yvan Avenas Pierre Lefranc Pierre Olivier Jeannin Hadi Alawieh | 2022/6/30 |
Power module using ceramic heat sink and multilayers silver sintering | IEEE Transactions on Components, Packaging and Manufacturing Technology | Nicolas Botter Rabih Khazaka Yvan Avenas Didier Bouvard Jean-Michel Missiaen | 2022/5/30 |
Design of Wire Bondless Double-Sided Cooled Power Module Using Ceramic Heat Sink and Multilayer Silver Sintering | Nicolas Botter Rabih Khazaka Yvan Avenas Didier Bouvard Jean Michel Missiaen | 2022/5/10 | |
2022 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 12 | IEEE Transactions on Components, Packaging and Manufacturing Technology | KE Aasmundtveit M Abu Bakar R Achar N Achutananda E Adolfsson | 2022/12 |
