Arsalan Alam

Arsalan Alam

University of California, Los Angeles

H-index: 11

North America-United States

About Arsalan Alam

Arsalan Alam, With an exceptional h-index of 11 and a recent h-index of 11 (since 2020), a distinguished researcher at University of California, Los Angeles, specializes in the field of Semiconductors, packaging, fabrication.

His recent articles reflect a diverse array of research interests and contributions to the field:

Smartphone App-Enabled Flex sEMG Patch using FOWLP

Flexible Hybrid Electronics Using Fan‐Out Wafer‐Level Packaging

Network on interconnect fabric and integrated antenna

Flexible and stretchable interconnects for flexible systems

Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane

Flexible heterogeneously integrated low form factor wireless multi-channel surface electromyography (sEMG) device

Development of FlexTrateTm and Demonstration of Flexible Heterogeneously Integrated Low Form-Factor Wireless Multi-Channel Surface Electromyography …

Nanowire Impregnated Poly-dimethyl Siloxane for Flexible, Thermally Conductive Fan-Out Wafer-Level Packaging

Arsalan Alam Information

University

Position

___

Citations(all)

355

Citations(since 2020)

308

Cited By

168

hIndex(all)

11

hIndex(since 2020)

11

i10Index(all)

11

i10Index(since 2020)

11

Email

University Profile Page

University of California, Los Angeles

Google Scholar

View Google Scholar Profile

Arsalan Alam Skills & Research Interests

Semiconductors

packaging

fabrication

Top articles of Arsalan Alam

Title

Journal

Author(s)

Publication Date

Smartphone App-Enabled Flex sEMG Patch using FOWLP

Pragathi Venkatesh

Randall Irwin

Arsalan Alam

Michael Molter

Ayush Kapoor

...

2022/5/31

Flexible Hybrid Electronics Using Fan‐Out Wafer‐Level Packaging

Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System‐in‐Package

Subramanian S Iyer

Arsalan Alam

2022/2/15

Network on interconnect fabric and integrated antenna

2022/2/1

Flexible and stretchable interconnects for flexible systems

2022/12/27

Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane

IEEE Transactions on Components, Packaging and Manufacturing Technology

Guangqi Ouyang

Amir Hanna

Samatha Benedict

Goutham Ezhilarasu

Arsalan Alam

...

2022/9/16

Flexible heterogeneously integrated low form factor wireless multi-channel surface electromyography (sEMG) device

A Alam

M Molter

A Kapoor

B Gaonkar

S Benedict

...

2021/6/1

Development of FlexTrateTm and Demonstration of Flexible Heterogeneously Integrated Low Form-Factor Wireless Multi-Channel Surface Electromyography …

Arsalan Alam

2021

Nanowire Impregnated Poly-dimethyl Siloxane for Flexible, Thermally Conductive Fan-Out Wafer-Level Packaging

R Irwin

Y Hu

A Alam

S Benedict

T Fisher

...

2020/6/3

A high spatial resolution surface electromyography (sEMG) system using fan-out wafer-level packaging on FlexTrate™

A Alam

M Molter

B Gaonkar

A Hanna

R Irwin

...

2020/6/3

Antenna on Silicon Interconnect Fabric

Arpan Dasgupta

Arsalan Alam

Guangqi Ouyang

SivaChandra Jangam

Subramanian S Iyer

2020/6/3

Heterogenous integration of MEMS gas sensor using FOWLP: Personal environment monitors

Samatha Benedict

Ashvin Nagarajan

K Thejas

Arsalan Alam

Murugaiya Sridar Illango

...

2020/6/3

See List of Professors in Arsalan Alam University(University of California, Los Angeles)