Abderrahim EL AMRANI

Abderrahim EL AMRANI

Université de Sherbrooke

H-index: 4

North America-Canada

About Abderrahim EL AMRANI

Abderrahim EL AMRANI, With an exceptional h-index of 4 and a recent h-index of 4 (since 2020), a distinguished researcher at Université de Sherbrooke, specializes in the field of Advanced Heterogeneous Integration, Semiconductor Packaging and Interconnects.

His recent articles reflect a diverse array of research interests and contributions to the field:

HETEROGENEOUS SOLDER BUMP STRUCTURE

A novel chip-join assembly using heterogeneous sn-ag bumps

Développement d’un procédé d’électrodéposition séquentielle pour fabrication des microbilles à haute densité

Heterogenous bump metallurgy through a sequential plating based process

A study of low-cost sequential electroplating bumping process and its metallurgical behavior

Abderrahim EL AMRANI Information

University

Université de Sherbrooke

Position

PhD

Citations(all)

59

Citations(since 2020)

41

Cited By

36

hIndex(all)

4

hIndex(since 2020)

4

i10Index(all)

1

i10Index(since 2020)

0

Email

University Profile Page

Université de Sherbrooke

Abderrahim EL AMRANI Skills & Research Interests

Advanced Heterogeneous Integration

Semiconductor Packaging and Interconnects

Top articles of Abderrahim EL AMRANI

HETEROGENEOUS SOLDER BUMP STRUCTURE

Published Date

2024/4/4

There is provided a solder bump structure comprising an under bump metallurgy (UBM) layer, a first solder portion over the UBM layer, the first solder portion having a first composition, a barrier layer encapsulating the first solder portion, and a second solder portion over the barrier layer, the second solder portion having a second composition different from the first composition.

A novel chip-join assembly using heterogeneous sn-ag bumps

Authors

Abderrahim El Amrani,Étienne Paradis,David Danovitch,Dominique Drouin

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Published Date

2021/3/10

In this article, a flip-chip assembly using a heterogeneous solder bump structure is studied. The metallurgical and shape evolution, from bump fabrication through final assembly, is presented, characterized, and discussed. Aiming for lower residual stress during flip-chip assembly, a sequentially plated bump is fabricated to ensure a ductile low Ag content solder proximate to the fragile chip back end of line (BEOL) layers while providing a separate solder portion with a high Ag content. Such a heterogeneous structure is enabled by the integration of a Ni cap barrier within the sequential electroplating process that serves to prevent Ag diffusion between the two distinct solder portions. The heterogeneous structure is shown to remain intact through the chip join operation, thereby proposing improved BEOL integrity during joint solidification. Further, the cap barrier induces a unique, pillar-like solder structure that provides …

Développement d’un procédé d’électrodéposition séquentielle pour fabrication des microbilles à haute densité

Authors

Abderrahim El Amrani

Published Date

2020/12/1

Aujourd’hui l’industrie des semiconducteurs aborde une époque requérant le couplage de l’innovation au niveau de l’assemblage avec la mise à l’échelle des dispositifs. Cette dernière n’est plus l’élément clé qui propulse l’évolution technologique à cause de l’énorme investissement requis vis-à-vis sa rentabilité qui devient de plus en plus limitée. Avec la réorientation de l’intérêt de la majorité des acteurs vers l’innovation au niveau des assemblages, cette thèse s’ inscrit dans un contexte d’amélioration de la fiabilité des assemblages de larges puces renversées pour le calul haute performance à travers le développement des microbilles de brasures à faible coût et de métallurgie optimisée. Des microbilles de brasure à faible coût et hétérogènes sont proposées comme une approche simple qui présente des bénéfices métallurgiques et économiques. D’une part, l’électrodéposition séquentielle des couches de Sn et Ag pures au lieu d’alliage est réalisée à un faible coût d’acquisition et avec une simplicité de maintenance. D’une autre part, la même installation d’électrodéposition de Sn et Ag purs peut servir à la fabrication d’une multitude de brasures avec différentes teneurs en Ag. Malgré le besoin d’une standardisation des procédés de fabrication des microbilles, les motivations citées précédemment peuvent constituer un facteur d’attraction pour l’industrie afin de l’adopter comme alternative à l’électrodéposition conventionnelle des alliages. En plus de son faible coût, l’approche de fabrication des microbilles par électrodéposition séquentielle amène une flexibilité métallurgique avec l’utilisation d’une barrière qui limite la diffusion d’Ag …

Heterogenous bump metallurgy through a sequential plating based process

Authors

A El Amrani,E Paradis,D Danovitch,D Drouin

Published Date

2020/6/3

A novel, heterogeneous solder bump structure and means to achieve is proposed. By exploiting a sequential plating process for bump fabrication, a diffusion barrier is placed between solder structures comprising different Ag contents. By controlling the nature and shape of the barrier, a specific structure was derived that successfully maintained a low Ag, ductile solder region proximal to the fragile BEOL of the chip during all solder reflow processes that would occur prior to a reinforcing underfill. A subsequent long dwell reflow step was demonstrated to be capable of breaking the barrier to allow Ag diffusion from the high Ag content region, thus creating a homogeneous interconnect structure with sufficiently high Ag content to encourage high electromigration resistance. The derived temporary structure has the added advantage of ensuring a high aspect ratio, pillar-like solder structure that enables a high-density …

A study of low-cost sequential electroplating bumping process and its metallurgical behavior

Authors

Abderrahim El Amrani,Étienne Paradis,David Danovitch,Dominique Drouin

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Published Date

2020/3/4

Studies were conducted to validate from a metallurgical point of view whether a lower cost sequential plating approach to SnAg and SnAgCu (SAC) solder bumping is a suitable alternative to the conventional alloy plating process. A range of Ag content corresponding to typical bump applications was explored with respect to Ag diffusion and intermetallic compound (IMC) formation. Variables that can affect such IMC formation were further explored as a function of underbump metallization (UBM) structure and cooling rate during bump solidification. By comparing the results to those previously reported on SnAg-based alloys, it is demonstrated that the proposed sequential plating process produces very similar microstructures and Ag 3 Sn IMC morphologies, due to the rapid diffusion and distribution of Ag through the liquid Sn. Known means to mitigate the less desirable large Ag 3 Sn platelets, that is by changing the …

See List of Professors in Abderrahim EL AMRANI University(Université de Sherbrooke)

Abderrahim EL AMRANI FAQs

What is Abderrahim EL AMRANI's h-index at Université de Sherbrooke?

The h-index of Abderrahim EL AMRANI has been 4 since 2020 and 4 in total.

What are Abderrahim EL AMRANI's top articles?

The articles with the titles of

HETEROGENEOUS SOLDER BUMP STRUCTURE

A novel chip-join assembly using heterogeneous sn-ag bumps

Développement d’un procédé d’électrodéposition séquentielle pour fabrication des microbilles à haute densité

Heterogenous bump metallurgy through a sequential plating based process

A study of low-cost sequential electroplating bumping process and its metallurgical behavior

are the top articles of Abderrahim EL AMRANI at Université de Sherbrooke.

What are Abderrahim EL AMRANI's research interests?

The research interests of Abderrahim EL AMRANI are: Advanced Heterogeneous Integration, Semiconductor Packaging and Interconnects

What is Abderrahim EL AMRANI's total number of citations?

Abderrahim EL AMRANI has 59 citations in total.

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