A. A. Saad
Universiti Sains Malaysia
H-index: 12
Asia-Malaysia
Top articles of A. A. Saad
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Structural Assessment of Silver Conductive Ink using Nanoindentation | Journal of Current Science and Technology | Zuraihana Bachok Abdullah Aziz Saad Sana Zulfiqar Aizat Abas Mohamad Danial Shafiq | 2024/5/2 |
Hyper-Elastic Characterization of Polydimethylsiloxane by Optimization Algorithms and Finite Element Methods | Arabian Journal for Science and Engineering | Sana Zulfiqar Abdullah Aziz Saad Ilyas Ahmad Huqqani Zulkifli Ahmad Feizal Yusof | 2024/3/15 |
Mechanical Analysis and Constitutive Modeling of Nonlinear Behavior of Silver-based Conductive Ink | International Journal of Automotive and Mechanical Engineering | S Zulfikar Abdullah Aziz Saad Z Ahmad Z Bachok | 2023/9/26 |
Structural Analysis of Silver-Based Conductive Ink Under Cyclic Loading | Sana Zulfiqar Abdullah Aziz Saad Zulkifli Ahmad Feizal Yusof Zuraihana Bachok | 2022/9/14 | |
Numerical Analysis and Validation of Characterization of Polydimethylsiloxane Using Hyper-elastic Constitutive Models | Pertanika Journal of Science & Technology | Sana Zulfiqar Abdullah Aziz Saad Zulkifli Ahmad Feizal Yusof Zuraihana Bachok | 2023/10/1 |
Validation of experimental analysis of the PC thermoformed product using finite element methods | AIP Conference Proceedings | Sana Zulfiqar Abdullah Aziz Saad Mohamad Fikri Mohd Sharif Zambri Samsudin Mohd Yusuf Tura Ali | 2023/11/9 |
Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste | FC Ani AA Saad A Jalar CY Khor MA Abas | 2022/3/1 | |
Development of a Virtual Vehicle Identification for Tracking Hit-and-Run Vehicle | Boon Sheng Khoo Abdullah Aziz Saad Mohamad Khairi Ishak | 2022/11/9 | |
Structural analysis on nanocomposites lead free solder using nanoindentation | Journal of Advanced Manufacturing Technology (JAMT) | Z Bachok AA Saad MA Abas MYT Ali K Fakpan | 2022/6/22 |
Analysis and characterization of polydimethylsiloxane (PDMS) substrate by using uniaxial tensile test and Mooney-Rivlin hyperelastic model | Journal of Advanced Manufacturing Technology (JAMT) | S Zulfiqar AA Saad Z Ahmad F Yusof K Fakpan | 2022/4/29 |
Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process | Microelectronics Reliability | S Zulfiqar AA Saad MFM Sharif Z Samsudin MYT Ali | 2021/12/1 |
Structural analysis and material characterization of silver conductive ink for stretchable electronics | International Journal of Integrated Engineering | S. Zulfigar A. A. Saad F. Yusof Ahmad Z Z. Bachok | 2021/9 |
Stress analysis of stretchable conductive polymer for electronics circuit application | NA Aziz AA Saad Z Ahmad S Zulfiqar FC Ani | 2020/1/1 | |
Mechanical reliability of self-aligned chip assembly after reflow soldering process | Soldering & Surface Mount Technology | Mohd Najib Ali Mokhtar MZ Abdullah Abdullah Aziz Saad Fakhrozi Cheani | 2020/4 |
Structural and Random Vibration Analysis of LEDs Conductive Polymer Interconnections | IOP Conference Series: Materials Science and Engineering | S Zulfiqar AA Saad MA Wan Chek MFM Sharif Z Samsudin | 2020 |
Co-Authors
