André Zimmermann
Universität Stuttgart
H-index: 27
Europe-Germany
Top articles of André Zimmermann
Title | Journal | Author(s) | Publication Date |
|---|---|---|---|
Product Development Processes for Individualized Products: A Case Study | IEEE Transactions on Engineering Management | Faruk Civelek Alexander Brem Karl-Peter Fritz André Zimmermann | 2024/4/8 |
Integration of Mechatronic Functions on Additively Manufactured Components via Laser-Assisted Selective Metal Deposition | Advanced Functional Materials | Tobias Vieten Sascha Weser Alexander Schilling Kerstin Gläser Andre Zimmermann | 2024/3/5 |
A 10 V Transfer Standard Based on Low-Noise Solid-State Zener Voltage Reference ADR1000 | Metrology | Andre Bülau Daniela Walter Andre Zimmermann | 2024/3/5 |
Modeling and experimental analysis of low-cost MEMS gyroscopes under PCB bending stress | Wolfram Mayer Alexandra Küster Patrick Tritschler Tobias Hiller Dušan Radović | 2023/3/28 | |
Image Analysis Based Evaluation of Print Quality for Inkjet Printed Structures | Journal of Manufacturing and Materials Processing | Tim Horter Holger Rühl Wenqi Yang Yu-Sheng Chiang Kerstin Gläser | 2023/1/10 |
Investigation of a Finite-Difference-Method based real-time viscous heating compensation in a nozzle viscometer for inline viscosity measurement of phenol resins | Polymer Testing | Peter Wappler Romit Kulkarni Thomas Guenther Serhat Sahakalkan Karl-Peter Fritz | 2023/11/1 |
Fertigung eines mikrostrukturierten Werkzeugeinsatzes zur kostengünstigen Herstellung von Hybridoptiken | Kevin Treptow S Wagner C Pruß A Zimmermann A Herkommer | 2023 | |
Injection Compression Molding of LDS-MID for Millimeter Wave Applications | Journal of Manufacturing and Materials Processing | Marius Wolf Kai Werum Wolfgang Eberhardt Thomas Günther Andre Zimmermann | 2023/10/13 |
Sensor Individual Non-Orthogonality Correction in Low-Cost MEMS Gyroscopes Using Neural Networks | Patrick Tritschler Tobias Hiller Torsten Ohms Wolfram Mayer André Zimmermann | 2023/3/28 | |
On the influence of lid materials for flip-chip ball grid array package applications | Microelectronics Reliability | Mateus Bagetti Jeronimo Jens Schindele Hubert Straub Przemyslaw Jakub Gromala Bernhard Wunderle | 2023/1/1 |
Optical two-mode squeezed interferometer for enhanced chip-integrated quantum-metrology | arXiv preprint arXiv:2309.10602 | Patrick Tritschler Torsten Ohms André Zimmermann Fabian Zschocke Peter Degenfeld-Schonburg | 2023/9/19 |
Adhesion-Induced Demolding Forces of Hard Coated Microstructures Measured with a Novel Injection Molding Tool | Polymers | Maximilian Schönherr Holger Rühl Thomas Günther Andre Zimmermann Bernd Gundelsweiler | 2023/3/3 |
Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications | Journal of Manufacturing and Materials Processing | Marius Wolf Kai Werum Thomas Guenther Lisa Schleeh Wolfgang Eberhardt | 2023/8/3 |
Direct Processing of PVD Hard Coatings via Focused Ion Beam Milling for Microinjection Molding | Micromachines | Rühl. Holger Thomas Günther Andre Zimmermann | 2023/1/22 |
Investigating the Effects of Stress on Die Deformation and on Cross-Axis Offset Drift in Mode-Split MEMS Gyroscopes | Sensor Letters | Wolfram Mayer Burkhard Kuhlmann Tobias Hiller Thorsten Balslink Ulrich Kunz | 2023/11/23 |
Injection Molding of Encapsulated Diffractive Optical Elements | Micromachines | Stefan Wagner Kevin Treptow Sascha Weser Marc Drexler Serhat Sahakalkan | 2023/6/9 |
Detection schemes for two-mode squeezed fiber optic Sagnac interferometry | Sensor Letters | Patrick Tritschler Torsten Ohms Peter Degenfeld-Schonburg Fabian Zschocke Andre Zimmermann | 2023/11/18 |
Review on Excess Noise Measurements of Resistors | Sensors | Daniela Walter Andre Bülau Andre Zimmermann | 2023/1/18 |
Material property variability of composites in thermo-mechanical studies involving virtual design of experiments | IEEE Transactions on Components, Packaging and Manufacturing Technology | Mateus Bagetti Jeronimo Hubert Straub Martin Hager Andre Zimmermann | 2022/4/1 |
Experimental Investigation of Moisture Induced Offset Drifts on Plastic Packaged MEMS Sensor Devices | Journal of Microelectromechanical Systems | Clemens Jurgschat Rolf Scheben Imre Toth Torsten Ohms Oliver Kohn | 2022/6/30 |
Co-Authors
