Xiaobin Feng

About Xiaobin Feng

Xiaobin Feng, With an exceptional h-index of 16 and a recent h-index of 16 (since 2020), a distinguished researcher at City University of Hong Kong,

His recent articles reflect a diverse array of research interests and contributions to the field:

A nanotwin-based physical model for designing robust layered bismuth telluride thermoelectric semiconductor

Optimization of Mechanical and Thermoelectric Properties of SnTe‐Based Semiconductors by Mn Alloying Modulated Precipitation Evolution

Oxidation-induced superelasticity in metallic glass nanotubes

Strain-Induced Defect Evolution for the Construction of Porous Cu2–xSe with Enhanced Thermoelectric Performance

Stacking fault-induced strengthening mechanism in thermoelectric semiconductor Bi2Te3

Synergetic Enhancement of Strength–Ductility and Thermoelectric Properties of Ag2Te by Domain Boundaries

Dense dislocations induced ductile SnTe thermoelectric semiconductor over a wide range of temperatures

Toughening thermoelectric materials: from mechanisms to applications

Xiaobin Feng Information

University

Position

___

Citations(all)

1288

Citations(since 2020)

1254

Cited By

273

hIndex(all)

16

hIndex(since 2020)

16

i10Index(all)

22

i10Index(since 2020)

22

Email

University Profile Page

Google Scholar

Top articles of Xiaobin Feng

A nanotwin-based physical model for designing robust layered bismuth telluride thermoelectric semiconductor

Cell Reports Physical Science

2024/2/26

Optimization of Mechanical and Thermoelectric Properties of SnTe‐Based Semiconductors by Mn Alloying Modulated Precipitation Evolution

Small

2024/1/20

Strain-Induced Defect Evolution for the Construction of Porous Cu2–xSe with Enhanced Thermoelectric Performance

ACS Applied Materials & Interfaces

2023/12/6

Stacking fault-induced strengthening mechanism in thermoelectric semiconductor Bi2Te3

Matter

2023/9/6

Synergetic Enhancement of Strength–Ductility and Thermoelectric Properties of Ag2Te by Domain Boundaries

Advanced Materials

2023/9

Dense dislocations induced ductile SnTe thermoelectric semiconductor over a wide range of temperatures

Journal of Materials Science & Technology

2023/5/1

Toughening thermoelectric materials: from mechanisms to applications

2023/3/28

Direct 3D printing of thin-walled cardiovascular stents with negative Poisson’s ratio (NPR) structure and functional metallic coating

Composite Structures

2023/2/15

A Lightweight AlTiVNb High-Entropy Alloy Film with High Strength-Ductility Synergy and Corrosion Resistance

Materials

2022/12/1

Xiaobin Feng
Xiaobin Feng

H-Index: 8

Yang Lu
Yang Lu

H-Index: 13

Tailoring mechanical properties of PμSL 3D-printed structures via size effect

International Journal of Extreme Manufacturing

2022/10/3

Nanocrystalline (AlTiVCr) N multi-component nitride thin films with superior mechanical performance

Nanomaterials

2022/1

Xiaobin Feng
Xiaobin Feng

H-Index: 8

Yang Lu
Yang Lu

H-Index: 13

Nanolayered CoCrFeNi/graphene composites with high strength and crack resistance

Nanomaterials

2022/6/20

Deformation Mechanism of Depositing Amorphous Cu-Ta Alloy Film via Nanoindentation Test

Nanomaterials

2022/3/21

Hollow medium-entropy alloy nanolattices with ultrahigh energy absorption and resilience

NPG Asia Materials

2021/12

High elasticity of CsPbBr3 perovskite nanowires for flexible electronics

Nano Research

2021/11

Local chemical fluctuation mediated ductility in body-centered-cubic high-entropy alloys

Materials Today

2021/6/1

Zr addition-dependent twin morphology evolution and strengthening response in nanostructured Al thin films

Materialia

2021/5/1

Effect of Zr addition on microstructure and mechanical properties of CoCrFeNiZrx high-entropy alloy thin films

Metals and Materials International

2023/6

Three-dimensional stretchable microelectronics by projection microstereolithography (PμSL)

ACS Applied Materials & Interfaces

2021/2/15

See List of Professors in Xiaobin Feng University(City University of Hong Kong)